A machine tools for processing of a saw disk includes a processor; a spindle unit having a shank provided with a flange to mount the saw disk to be rotated for processing for planarity thereof; sensor assembly having a sensor to be slide from the periphery of said saw disk to the centre thereof, wherein said sensor detects areas of discrepancy in planarity in each part of a disk face of said saw disk and communicating said data to said processor; and a hammer assembly connected to a transverse carriage assembly, the hammer assembly having: a beating head, and a preloading spring with a preload piston coupled to the beating head, wherein the preload piston is configured to load the preloading spring to transfer elastic energy to the beating head for giving, said beating head, the thrust for striking the areas of discrepancy of the saw disk.

Saw blades and methods of machining saw blade tooth profiles of saw blades. The saw blades include a blade body and a plurality of teeth defined by the blade body. Each tooth includes a tooth back, a tooth tip, a tooth face, and a tooth gullet. In at least one tooth, a relief region extends toward the tooth back and separates the tooth face from the tooth gullet. The methods include supporting the saw blade with a blade support structure and advancing the saw blade with a blade advance structure. The methods also include dry-machining a finished tooth profile in a working portion of the saw blade in a single pass. The dry-machining includes dry-machining with an end mill by operatively translating the end mill relative to the saw blade and within a plane that is at least substantially perpendicular to an end mill rotational axis of the end mill.

A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

The present invention is part of machine tools that today are widely used in all mechanical workshops, often being designed and built also to perform very specific tasks.

In particular, the present invention relates to the processing of discs for circular saws or saw-disks.

A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

Saw blades and methods of machining saw blade tooth profiles of saw blades. The saw blades include a blade body and a plurality of teeth defined by the blade body. Each tooth includes a tooth back, a tooth tip, a tooth face, and a tooth gullet. In at least one tooth, a relief region extends toward the tooth back and separates the tooth face from the tooth gullet. The methods include supporting the saw blade with a blade support structure and advancing the saw blade with a blade advance structure. The methods also include dry-machining a finished tooth profile in a working portion of the saw blade in a single pass. The dry-machining includes dry-machining with an end mill by operatively translating the end mill relative to the saw blade and within a plane that is at least substantially perpendicular to an end mill rotational axis of the end mill.

Systems and methods for milling saw blade tooth profiles and saw blades with milled tooth profiles are disclosed herein. The systems include blade milling systems that include a milling head, a blade support structure, a blade advance structure, and a control system. The methods include supporting a saw blade, advancing the saw blade, and machining a finished tooth profile in a working portion of the saw blade with an end mill. In some embodiments, the machining may include operatively translating the end mill relative to the saw blade with a milling head and within a plane that is at least substantially perpendicular to an end mill rotational axis. In some embodiments, the machining may include dry-machining the finished tooth profile in the working portion of the saw blade in a single pass. The saw blades include a plurality of teeth and may include at least one relief region.

Systems and methods for milling saw blade tooth profiles and saw blades with milled tooth profiles are disclosed herein. The systems include blade milling systems that include a milling head, a blade support structure, a blade advance structure, and a control system. The methods include supporting a saw blade, advancing the saw blade, and machining a finished tooth profile in a working portion of the saw blade with an end mill. In some embodiments, the machining may include operatively translating the end mill relative to the saw blade with a milling head and within a plane that is at least substantially perpendicular to an end mill rotational axis. In some embodiments, the machining may include dry-machining the finished tooth profile in the working portion of the saw blade in a single pass. The saw blades include a plurality of teeth and may include at least one relief region.

Methods, apparatuses, and systems associated with a sample testing device are provided. For example, an example sample testing device may include a substrate layer defining a bottom surface of the sample testing device, as well as a waveguide disposed on the substrate layer and includes at least one reference channel and at least one sample channel.

Methods, apparatuses, and systems associated with a sample testing device are provided. For example, an example sample testing device may include a substrate layer defining a bottom surface of the sample testing device, as well as a waveguide disposed on the substrate layer and includes at least one reference channel and at least one sample channel.