A machining system for electromachining a workpiece that in one embodiment includes a machine tool, a cutting tool for performing the eletromachining, and a tool holding apparatus for conductively holding the cutting tool and coupled to the machine tool. The tool holding apparatus includes a holding element for holding the cutting tool and at least one solution releasing element. The solution releasing element is used to receive machining solution and release the machining solution onto a predetermined area of the cutting tool through at least one group of channels. Each group of channels includes at least two channels configured to respectively release the machining solution onto at least two adjacent sections in the predetermined area of the cutting tool.

Electroerosion devices and methods for performing electroerosion machining are disclosed. The electroerosion devices may perform simultaneous electrical discharge machining and pulsed electrochemical machining (S-ED/PEC) through electrode assembly design and the use of two different working fluids.

Electroerosion devices and methods for performing electroerosion machining are disclosed. The electroerosion devices may perform simultaneous electrical discharge machining and pulsed electrochemical machining (S-ED/PEC) through electrode assembly design and the use of two different working fluids.

Electroerosion devices and methods for performing electroerosion machining are disclosed. The electroerosion devices may perform simultaneous electrical discharge machining and pulsed electrochemical machining (S-ED/PEC) through the use of at least two different types of electrodes and a quasi-dielectric working fluid.

Electroerosion devices and methods for performing electroerosion machining are disclosed. The electroerosion devices may perform simultaneous electrical discharge machining and pulsed electrochemical machining (S-ED/PEC) through the use of at least two different types of electrodes and a quasi-dielectric working fluid.

An electrochemical machining device includes a plurality of electrodes, a guiding member and a plate member. The electrodes are disposed around a workpiece. The guiding member is configured to limit and guide each of the electrodes to move. The plate member is configured to exert a force to each of the electrodes. The driving member is configured to rotate the workpiece. The plate member is connected to each of the electrodes. A force-exerting direction of the force from the plate member to each of the electrodes is parallel to a central axis of each of the electrodes or deflects off the central axis. Each of the electrodes is passed through the guiding member and configured to perform a machining on the workpiece which is rotated by the driving member, and each of the electrodes has an electrochemical machining direction which is perpendicular, oblique or parallel to the workpiece.

An electrochemical machining device includes a plurality of electrodes, a guiding member and a plate member. The electrodes are disposed around a workpiece. The guiding member is configured to limit and guide each of the electrodes to move. The plate member is configured to exert a force to each of the electrodes. The driving member is configured to rotate the workpiece. The plate member is connected to each of the electrodes. A force-exerting direction of the force from the plate member to each of the electrodes is parallel to a central axis of each of the electrodes or deflects off the central axis. Each of the electrodes is passed through the guiding member and configured to perform a machining on the workpiece which is rotated by the driving member, and each of the electrodes has an electrochemical machining direction which is perpendicular, oblique or parallel to the workpiece.

An electromachining system includes at least one steerable electrode. The steerable electrode includes an electrode positioning mechanism configured to facilitate six degrees of freedom referenced to a pitch axis, a yaw axis, and a roll axis. The three axes are substantially perpendicular to each other. The electrode positioning mechanism includes a first end and a rotatable electrode tip coupled to the first end.

Disclosed is a wafer slicing apparatus which cuts a silicon ingot to fabricate a silicon wafer, and more specifically, a silicon wafer slicing apparatus cutting the silicon ingot using wire discharge machining is disclosed. The present invention provides a silicon wafer slicing apparatus using wire discharge machining comprising: a water tank which contains an electrolyte; a cutting wire which has a cutting section dipped into the water tank and is transferred by a wire driving means; an ingot transferring unit which includes an electrode on which a silicon ingot, an object to be cut, is fixed, and moves the silicon ingot up and down within the cutting section of the cutting wire; an electrolyte circulating means which circulates and refines the electrolyte stored in the water tank; and a power supply unit which supplies a source voltage to the electrode of the ingot transferring unit and the cutting wire.

Disclosed is a wafer slicing apparatus which cuts a silicon ingot to fabricate a silicon wafer, and more specifically, a silicon wafer slicing apparatus cutting the silicon ingot using wire discharge machining is disclosed. The present invention provides a silicon wafer slicing apparatus using wire discharge machining comprising: a water tank which contains an electrolyte; a cutting wire which has a cutting section dipped into the water tank and is transferred by a wire driving means; an ingot transferring unit which includes an electrode on which a silicon ingot, an object to be cut, is fixed, and moves the silicon ingot up and down within the cutting section of the cutting wire; an electrolyte circulating means which circulates and refines the electrolyte stored in the water tank; and a power supply unit which supplies a source voltage to the electrode of the ingot transferring unit and the cutting wire.