A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.

The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The methods may also include rupturing the shells of the solder particles to release the liquid metal cores. The methods may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.

A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion; an electronic device mounting board using the mounting wiring board; a method of mounting the electronic device; a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; and a microwave heating apparatus.

Disclosed herein are power electronic modules formed by directly bonding a heat sink to a dielectric substrate using transition liquid phase bonding.

A rotary valve can include a housing, a manifold with multiple flow paths can be fixedly mounted to the housing. A rotary actuator with a first surface can be rotatably mounted within the housing, and a valve seat with a second surface can be fixedly attached to the manifold, where the second surface can sealingly engage the first surface. The rotary actuator can include a gap that selectively aligns with respective ones of valve seat ports as the rotary actuator rotates relative to the valve seat, thereby selectively pressurizing one or more actuators. A system and method can include a rotary valve that selectively causes pads to extend at a predetermined orientation in the wellbore to steer a drill bit. The azimuthal orientation of a rotary actuator of the valve can determine which pads are extended and which are retracted as the drill bit rotates.

A power transmission device and a method of manufacturing the same capable of shortening a shaft length and improving mountability are provided. A power transmission device according to the present disclosure includes a planetary carrier configured to support a pinion shaft pivotally supporting a pinion gear, rotatably support the pinion gear, and cause the pinion gear to revolve by rotation of the planetary carrier and a planetary carrier plate fixed fo face the planetary carrier on a side where the pinion gear is positioned, and including dog teeth integrally formed with the planetary carrier plate.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

A method of manufacturing a saw blade includes placing at least one tooth in an holder where at least one face of the tooth is covered and at least one face of the tooth is exposed, coating the exposed face, and after the coating, joining the tooth to a blade backer at an uncoated face.

The present disclosure relates to a brazing structure. The brazing structure may comprise a first portion and a second portion. At least one of the first portion or the second portion may include a connection-reinforcing surface. The connection-reinforcing surface may include a groove region and a filler placement region. The filler placement region may be configured to hold a filler material in solid state before brazing. The groove region may include a plurality of grooves where the filler material flows into after being melted. The first portion and the second portion may be connected by a braze joint formed by the filler material.