A fan module for a soldering system and a soldering system, in particular for a reflow soldering system, for circulating air in a process channel of the soldering system, the module having a housing-like support part, a first shaft bearing provided in or on the support part, a motor, which includes a stator and a rotor which cooperates with the stator, a rotor shaft provided on the rotor, a fan wheel provided on the rotor shaft and having a second shaft bearing for supporting the rotor shaft, wherein the fan module includes a flange plate, which in the assembled state covers a channel opening in the process channel and which includes an aperture in or on which the second shaft bearing is provided.

The present disclosure provides a reflow oven, which comprises: a soldering section provided with N soldering sub-zones and comprising a heating zone and a cooling zone, the cooling zone comprising a soldering sub-zone; an inlet zone and an outlet zone respectively provided at two ends of the soldering section; a first inlet zone isolation duct in communication with an upper side or a lower side of the inlet zone; M purification sub-zones, wherein each of the M purification sub-zones is in communication with a corresponding one of the N soldering sub-zones, and M is less than or equal to N, wherein one end of the first inlet zone isolation duct is in communication with a communication port of the inlet zone, and the other end of the first inlet zone isolation duct is in communication with the soldering sub-zone of the cooling zone.

The present disclosure provides a reflow oven, which comprises: a soldering section provided with N soldering sub-zones and comprising a heating zone and a cooling zone, the cooling zone comprising a soldering sub-zone; an inlet zone and an outlet zone respectively provided at two ends of the soldering section; a first inlet zone isolation duct in communication with an upper side or a lower side of the inlet zone; M purification sub-zones, wherein each of the M purification sub-zones is in communication with a corresponding one of the N soldering sub-zones, and M is less than or equal to N, wherein one end of the first inlet zone isolation duct is in communication with a communication port of the inlet zone, and the other end of the first inlet zone isolation duct is in communication with the soldering sub-zone of the cooling zone.

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow oven further comprises a first pipeline, a second pipeline and a third pipeline. When the reflow oven operates in air mode, external clean air is delivered to the heating zone and is discharged from the heating zone and the blocked exhaust zone. When the reflow oven operates in inert gas mode, an inert gas is delivered from the blocked exhaust zone to the heating zone and is discharged from the heating zone. Satisfying the accurate temperature profiling necessary for reflow processing in the operation atmosphere of air or an inert gas, the reflow oven in the present application can effectively discharge volatile pollutants to reduce the number of follow-up services and maintenances. In addition, the reflow oven in the present application can save the expensive inert gas.

The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow oven further comprises a first pipeline, a second pipeline and a third pipeline. When the reflow oven operates in air mode, external clean air is delivered to the heating zone and is discharged from the heating zone and the blocked exhaust zone. When the reflow oven operates in inert gas mode, an inert gas is delivered from the blocked exhaust zone to the heating zone and is discharged from the heating zone. Satisfying the accurate temperature profiling necessary for reflow processing in the operation atmosphere of air or an inert gas, the reflow oven in the present application can effectively discharge volatile pollutants to reduce the number of follow-up services and maintenances. In addition, the reflow oven in the present application can save the expensive inert gas.

A component mounting method includes an application step of applying a specific solder paste including Sn and a metal other than Sn to a board; a disposition step of positioning and disposing an upper surface reference type component having a positioning reference on an upper surface with respect to one or more reference points on the board; and a reflow step of reflow-soldering the component by heating the board, in which in the specific solder paste, at least a part of the Sn is melted, and molten Sn and the metal other than Sn form an intermetallic compound in the reflow step, thereby fixing the upper surface reference type component to the board.

The invention relates to a method for producing a metal-ceramic substrate and to a furnace suitable for carrying out the method. With the method, a metal-ceramic substrate with increased thermal and current conductivity can be obtained. The method comprises the steps of providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, the solder material comprising a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal, and heating the stack, the stack passing through a heating zone for heating.

The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.