Novel High-Entropy Alloy (HEA) compositions are particularly suited to welding applications. The mixtures contain at least the elements nickel, manganese, cobalt, chromium, vanadium, molybdenum, and iron. The % weight of the constituents varies in accordance with the detailed description contained herein, with tolerances in the range of ±4% for major alloying elements and ±1% for minor alloying elements. The mixture may also contain a small amount of Aluminum, Titanium, and Boron with a tolerance in the range of +/−1% or, more preferably, +/−0.5% In accordance with the invention, the compositions above may be integrated into HEA welding products using cored wire and welding electrode manufacturing techniques, preferably starting with vacuum melted rolled alloys. One manufacturing process uses the compositions as an alloyed strip formed around the appropriate ground/crushed alloys to make commercially viable fabricated welding products.

The present disclosure is directed to a multi-segment device, such as an intravascular guide wire. The multi-segment device includes an elongate first portion comprising a first metallic material, an elongate second portion comprising a different metallic material, the first and second elongate portions being directly joined together end to end by a solid-state weld, and a heat affected zone surrounding an interface of the weld where the first and second portions are joined together, wherein the heat affected zone has an average thickness of less than about 0.20 mm.

A guidewire for use in intravascular procedures has an inner coil that is radiopaque and an outer coil that is non-radiopaque at the distal end of the guidewire. The radiopaque inner coil is visible under fluoroscopy so that the physician can monitor the location of the distal end of the guidewire during a procedure. The inner coil and the outer coil can be formed from a single wire or a multi-filar wire. The inner coil and the outer coil can have any of the following cross-sections for enhanced torquability: I-beam; vertical rectangular; vertical ellipse; square; peanut shape; vertical hexagonal; horizontal hexagonal; and horizontal ellipse.

A butt-welding device and a method for butt welding workpieces, especially for double-upset resistance-pressure butt-welding of workpieces, particularly wires, strands and profiles, has first and second clamping members for receiving the ends of the workpieces that are to be joined. At least one clamping means can be moved between a starting position and a welding position. At least one deburring tool is provided for deburring the welded workpiece ends. In addition, at least one sensor is provided to determine the geometric dimensions of the workpieces that are to be joined, especially the diameter, the width or the height in the joining plane or substantially parallel thereto, wherein a control unit controls the movement of the clamping members and/or of the deburring tool as a function of the geometric dimension.

A hairpin welding method welds wire ends of at least two copper wires, arranged flush next to one another, to one another by a laser beam. The laser beam is generated with a beam cross section that impinges on the wire ends at an end side and has a round core region and a ring region surrounding the round core region. A ratio of an external diameter of the ring region to a diameter of the core region is between 7:1 and 2:1. A ratio of a laser power in the core region to a laser power in the ring region is between 10:90 and 70:30.

A welding method includes providing a first connector having a first end, providing a second connector having a second end for being welded to the first end, overlapping the first end and the second end, applying a contactless heating to a central section of the first end and melting an end section of the first end facing the second connector, and cooling the first end and the second end to form a weld connecting the first connector and the second connector. The first connector and the second connector extend in opposite directions from the weld.

A wire bonding system is provided. The wire bonding system includes a bond head assembly configured to carry a wire bonding tool; and a wire replacement system configured to (i) remove a wire portion engaged with the wire bonding tool, the wire portion being part of a wire supply on the wire bonding system, and (ii) to replace the wire portion to be engaged with the wire bonding tool.

The present disclosure is directed to a multi-segment device comprising an elongate first portion comprising a first metallic material, an elongate second portion comprising a different metallic material, the first and second elongate portions being directly joined together end to end, a heat affected zone surrounding an interface of the elongate first portion and the elongate second portion, a shapeable distal end formed from at least a portion of the elongate second portion, a coil disposed about a portion of the elongate second portion.