Patent classifications
B23K103/08
Joining device and joining method
A joining device and method for laser-based joining of two components includes a first laser radiation source, a first radiation guide connected to the first radiation source to couple first laser radiation into the first radiation guide, a second laser radiation source, at least one second radiation guide connected to the second radiation source to couple second laser radiation into the second radiation guide, and a focusing device coupled to the laser radiations and focusing them at a distance from each other into a joining zone of the components. To reduce installation effort, the focusing device focuses the first and second laser radiations through a common beam path and a coupling device is connected on its input side to the first and second radiation guides and on its output side to the focusing device. The coupling device couples the first and second laser radiations into the common beam path.
Devices, systems and methods for three-dimensional printing
The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.
Copper production process
A process for a producing crude solder product and a copper product includes the steps of providing a black copper comprising >=50% wt of copper together with >=1.0% wt of tin and/or >=1.0% wt of lead, and refining a first portion of the black copper to obtain a refined copper product together with at least one copper refining slag. The process further includes the steps of recovering a first crude solder product from the copper refining slag, thereby forming a solder refining slag in equilibrium with the first crude solder product, and contacting a different portion of the black copper with the solder refining slag thereby forming a spent slag and a lead-tin based metal, followed by separating the spent slag from the lead-tin based metal.
Composite member manufacturing method and composite member
An object of the present invention is to provide an additively manufactured part with high temperature strength and high ductility that can be suitably used for hot forging even in the temperature range of 800° C. or more, and a manufacturing method therefor. The manufacturing method for the additively manufactured part in accordance with the present invention includes an additive manufacturing step of using composite powder containing ceramic and metal and having voids therein to form a composite material containing the ceramic and the metal by repeating steps of melting and solidifying the composite powder; and a remelting step of remelting the surface of the composite material.
High reliability leadfree solder alloys for harsh service conditions
High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.
Joined metal member and manufacturing method therefor
According to an embodiment, a method for manufacturing a joined metal member includes: disposing a first metal member inside a mold of an injection molding apparatus, the first metal member being made of a first metal material, unevenness being formed over a surface of the first metal member, and an oxide film being formed so as to cover the unevenness; and injecting a second metal material into the mold, and thereby molding a second metal member and joining the second metal member to the first metal member, the second metal material being, when it is injected into the mold, in a semi-molten state, or in a molten state in which a difference between a temperature of the second metal material and a liquidus temperature thereof is smaller than or equal to 30° C.
Method of forming a brazed joint having molybdenum material
A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.
Methods to shape a cemented carbide substrate using a laser
In one or more embodiments, a method includes selecting a cemented carbide substrate from a plurality of cemented carbide substrates in a substrate inventory. Each of the plurality of cemented carbide substrates have a substantially planar top surface. The method also includes emitting a plurality of laser pulses from a laser towards at least the substantially planar top surface of the cemented carbide substrate to ablate selected regions of the cemented carbide substrate thereby forming the cemented carbide substrate into a selected shape.
Flux, solder paste, and electronic circuit board
A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.
Method of cladding a pressure vessel
Cladding of the interior of a component part of a pressure vessel is shown. A lining which conforms to at least a portion of the interior geometry of the component is positioned in the interior of the component. The lining is then pressed into the component past its yield strength. The lining is then fused to the component.