A valve seat formed within an aluminum engine component includes a valve seat surface machined within the aluminum engine component, a layer of copper alloy material laser clad onto the valve seat surface of the aluminum engine component, the layer of copper alloy material having a thickness of less than 2.0 millimeters, and a layer of copper alloy/tool steel carbide material laser clad onto the layer of copper alloy material, the layer of copper alloy/tool steel carbide material having an average thickness of less than 0.5 millimeters, wherein the layer of copper alloy/tool steel carbide material has an outer surface that is machined to a final valve seat profile.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

A battery module includes cylindrical battery cells, a module housing, and a bus bar. The bus bar includes a main body portion that is positioned at a top or a bottom of the plurality of cylindrical battery cells and has a plate shape having upper and lower surfaces that are broader than a lateral surface of the main body portion in a horizontal direction; and a contact portion that is configured to electrically contact and be connected to an electrode terminal formed in one of the plurality of cylindrical battery cells, extends and protrudes from the main body portion in a horizontal direction, is stepped from the main body portion in a direction toward where the electrode terminal is positioned, and includes a branched structure bifurcated in two directions with respect to a direction in which the contact portion extends and protrudes from the main body portion.

Provided is a beryllium copper alloy bonded body including a first member made of a beryllium copper alloy and a second member made of a beryllium copper alloy, wherein the first member and the second member are bonded to each other via the nickel layer having a thickness of 8 μm or less.

A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining a mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for the mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrate with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.

A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

A filter, a manufacturing method for a filter, and an air conditioner are provided. The filter includes a casing, a transition tube, and a filter screen assembly. The filter screen assembly is provided in the casing, fitted with and connected to an inner wall of the casing, the casing is an integrally formed piece, and two axial ends of the casing have neck sections, and two neck sections are both fixedly connected to the transition tube.

A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrates with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.

The present invention provides a highly reliable solder joint, the solder joint including a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a NiPCu plating layer on a surface in contact with the solder joint layer, wherein the NiPCu plating layer contains Ni as a main component and contains 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, the NiPCu plating layer has a microcrystalline layer at an interface with the solder joint layer, and the microcrystalline layer includes a phase containing microcrystals of a NiCuP ternary alloy, a phase containing microcrystals of (Ni,Cu).sub.3P, and a phase containing microcrystals of Ni.sub.3P.