Patent classifications
B23K103/16
Method for workpiece processing and cutter manufacturing using a laser
A laser cutting method includes a step of determining a material to be removed and dividing the material to be removed into a plurality of material chips so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed on the workpiece to perform cutting in a first direction and a second direction, such that the material chips can be separated from the workpiece orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips through cutting along the boundary, the pattern on the workpiece is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.
Welding auxiliary joining part and method for connecting components by way of said welding auxiliary joining part
A welding auxiliary joining part is disclosed in the shape of a stud having a head, a shank and a tip. The welding auxiliary joining part is driven in by means of a mechanical-thermal setting method into a component of non- or poorly weldable material. During the driving in, a welding head is created due to mechanical deformation so that the component may be connected subsequently via the welding auxiliary joining part to a further component of weldable material by means of welding.
Method for manufacturing a decorative part
The automobile decorative-part (1) comprises a resin-compact (3) having a decorative-layer (2) on its surface-layer and comprises a clear-coat layer (4) for protecting said surface-layer, and that a high-gloss region (R1) of a relatively high-gloss level is mixed with a low-gloss region (R2) of a relatively low-gloss level on the surface of said decorative-part, and that a clear-coat paint is sprayed by an atomization-coating machine onto the surface of the decorative-layer (2), and that the atomization-coating machine contains an ester-based solvent of a low-boiling point as the main-solvent that has a boiling-point of 100 degrees Celsius or less and has a solid-content of 35 to 40 percent by mass, thus forming the clear-coat layer (4) that makes it partially possible to mat the gloss of the surface of the clear-coat layer, thus manufacturing a decorative-part with an excellent quality design.
High strength mechanical fastening inclusions for fiber reinforced polymer structures
A fastening inclusion is provided and includes a hard point made of coalesced metal sheets, metal or fiber flanges extending from edges of the hard point, and a fastener arranged on the hard point. The fastening inclusion can be incorporated into a fiber reinforced polymer structure by interleaving the flanges with fiber reinforced resin plies, and then curing the fiber reinforced plies to form a composite structure. The fastener on the hard point may be used for mechanically connecting the composite structure to a separate component, such as a metal component on a vehicle.
Light-transmitting decorated molding article and method of fabricating the same
A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.
Tamper evident hybrid resealable container
The present invention relates to a composite container comprising a bottom film layer and a top film layer at least partially adhered to the bottom film layer. The top film layer is scored to form at least one resealable flap and at least one pull tab which is not adhered to the bottom film layer. The bottom film layer comprises at least one cavity opening. A cardboard layer is adhered on its lower surface to the upper surface of the top film layer, wherein the cardboard layer has at least one cavity opening which is substantially aligned with the scoring of the top film layer resealable flap and the cardboard layer is perforated to define a perimeter of at least one pull tab which is substantially aligned with and adhered, on its underside, to the upper surface of the top film layer pull tab.
Assembly of at least 2 metallic substrates
A method for the manufacture of an assembly of at least two metallic substrates spot welded together through at least one spot welded joint, such method including two steps, the assembly obtainable according to this method and the use of this assembly for the manufacture of automotive vehicle.
Cutting machinery laser system
A cutting apparatus comprising a cutting table and a first cutting material belt movably supported about the cutting table about a first roller and a second roller. A second cutting material belt is removably supported above the first cutting material belt about the first roller and a third roller, wherein the second roller is intermediate the first roller and the second roller.
Laser welding multiple refractive coated transparent substrates
Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.
Layered bonding material, semiconductor package, and power module
A layered bonding material 10 includes a base material 11, a first solder section 12a stacked on a first surface of the base material 11, and a second solder section 12b stacked on a second surface of the base material 11. A coefficient of linear expansion of the base material 11 is 5.5 to 15.5 ppm/K, the first solder section 12a and the second solder section 12b are made of lead-free solder, and both of a thickness of the first solder section 12a and a thickness of the second solder section 12b are 0.05 to 1.0 mm.