A melt cutter includes a case, an electricity-connecting portion, a heating device, a working portion, a control portion, and a heat-dissipating device. The case has a heat-dissipating zone. The electricity-connecting portion is disposed in the case for connecting with an electricity source. The working portion is disposed in the case and has a gap with changeable size for clamping an object. The control portion alternatively triggers the heating device to heat and to transmit heat to the working portion, and it also reduces the size of the gap for melting and cutting the object. The heat-dissipating device is disposed at the heat-dissipating zone and is electrically connected with the electricity-connecting portion. Thereby, the heat-dissipating device helps air communication between interior and exterior of the case.

A melt cutter includes a case, an electricity-connecting portion, a heating device, a working portion, a control portion, and a heat-dissipating device. The case has a heat-dissipating zone. The electricity-connecting portion is disposed in the case for connecting with an electricity source. The working portion is disposed in the case and has a gap with changeable size for clamping an object. The control portion alternatively triggers the heating device to heat and to transmit heat to the working portion, and it also reduces the size of the gap for melting and cutting the object. The heat-dissipating device is disposed at the heat-dissipating zone and is electrically connected with the electricity-connecting portion. Thereby, the heat-dissipating device helps air communication between interior and exterior of the case.

A localized annealing process and a part having localized areas with increased ductility produced by the process. The part is formed of hard material, tempered, and/or otherwise hardened such that it meets minimum hardness and ductility requirements. The part further includes localized areas that have increased ductility for workability, which could include various types of deformation. The localized annealing process includes providing a part with low levels of ductility and then annealing localized areas of the part for increased ductility that will need to be machined or attached to another formed part. The annealing process includes placing an electrode on either side of the localized area and generating electricity through the localized area. The material in the localized area is then heated from the electricity to form a more ductile physical structure.

A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 m or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 m or greater.

A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 m or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 m or greater.

A process for creating an abstract art image may include forming a wire sculpture from conductive electrical wire; mounting the wire sculpture in a framework; operatively connecting the wire sculpture to a power supply having a voltage and a current necessary to melt the wire sculpture; starting the power on the power supply to slowly melt the wire sculpture; and photographing the melting wire sculpture over an extended time period.

An additively manufactured element includes a support structure connected to an article body. The connectors connecting the support structure to the article body are fused supports. Also disclosed is a method for removing the support structure from the article body by passing an electrical current through the fused supports, thereby breaking the fused supports.

An additively manufactured element includes a support structure connected to an article body. The connectors connecting the support structure to the article body are fused supports. Also disclosed is a method for removing the support structure from the article body by passing an electrical current through the fused supports, thereby breaking the fused supports.

A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 m or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 m or greater.

A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 m or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 m or greater.