An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

A portable stud welder apparatus is provided for welding a stud onto a work piece. The portable stud welder apparatus includes a housing and an energy storage device. A weld stud gun that is configured to hold a weld stud is electrically connected to the energy storage device for receiving energy from the energy storage device to pass a current through the stud and the work piece to form a weldment. At least one battery of the lithium ion type that is removeably coupled to the housing to establish an electrical connection with said energy storage device and provide energy to the energy storage device.

A portable stud welder apparatus is provided for welding a stud onto a work piece. The portable stud welder apparatus includes a housing and an energy storage device. A weld stud gun that is configured to hold a weld stud is electrically connected to the energy storage device for receiving energy from the energy storage device to pass a current through the stud and the work piece to form a weldment. At least one battery of the lithium ion type that is removeably coupled to the housing to establish an electrical connection with said energy storage device and provide energy to the energy storage device.

An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

A joining device includes: a first circuit in which a primary-side winding of a first transformer and a first capacitor are connected; a second circuit in which a primary-side winding of a second transformer and a second capacitor are connected; an electrode connected to secondary-side winding of the first transformer and secondary-side winding of the second transformer; and a charge switch configured to switch between energization/de-energization of the first and second capacitors from a power supply without the transformers being interposed. The first circuit has a first discharge switch and the second circuit has a second discharge switch. A method for manufacturing a joined object includes, by using the joining device, supplying an object to be joined to be sandwiched by the electrode; causing a current to flow through the electrode that sandwiches the object to be joined to join the object to be joined.

A joining device includes: a first circuit in which a primary-side winding of a first transformer and a first capacitor are connected; a second circuit in which a primary-side winding of a second transformer and a second capacitor are connected; an electrode connected to secondary-side winding of the first transformer and secondary-side winding of the second transformer; and a charge switch configured to switch between energization/de-energization of the first and second capacitors from a power supply without the transformers being interposed. The first circuit has a first discharge switch and the second circuit has a second discharge switch. A method for manufacturing a joined object includes, by using the joining device, supplying an object to be joined to be sandwiched by the electrode; causing a current to flow through the electrode that sandwiches the object to be joined to join the object to be joined.

A portable stud welder apparatus is provided for welding a stud onto a work piece. The portable stud welder apparatus includes a housing and an energy storage device. A weld stud gun that is configured to hold a weld stud is electrically connected to the energy storage device for receiving energy from the energy storage device to pass a current through the stud and the work piece to form a weldment. At least one battery of the lithium ion type is removeably coupled to the housing to establish an electrical connection with said energy storage device and provide energy to the energy storage device.

A portable stud welder apparatus is provided for welding a stud onto a work piece. The portable stud welder apparatus includes a housing and an energy storage device. A weld stud gun that is configured to hold a weld stud is electrically connected to the energy storage device for receiving energy from the energy storage device to pass a current through the stud and the work piece to form a weldment. At least one battery of the lithium ion type is removeably coupled to the housing to establish an electrical connection with said energy storage device and provide energy to the energy storage device.

An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

A battery-powered electronic resistance welding machine for sheet metal repair, comprising a machine unit (10), which includes a handle (12) and an activation and deactivation button (13), at least one first rod (14), which is constrained in a sliding fashion (F) to a terminal (15) of the machine unit (10), which has, at one free end, a ground electrode or tip (16) that comes into contact with at least one metal portion to create an electrical resistance circuit, at least one second rod (17), constrained in a sliding fashion (F) to the terminal (15), which has, at one free end, a welding or terminal electrode or tip (18) for the fixing of repair accessories of the metal portion. There is a rechargeable battery (11) in the machine unit (10), for example a lithium-polymer accumulator, which allows the electronic resistance welding machine to be powered without using the mains power supply.