A welding electrode may comprise a welding electrode body and a welding electrode cap that is connected or connectable to the welding electrode body for making contact between the welding electrode and a component for producing a welded connection. The problem of achieving an efficient heating of the sandwich sheet to be welded in a compact layout with the fewest possible modifications of the welding electrodes used heretofore is solved in that an electrically conductive resistance element integrated, or which can be integrated, in the welding electrode and which is connected or connectable in an electrically-conductive manner to the welding electrode body and the welding electrode cap is provided for the heating of the component. Furthermore, a method and a device with the welding electrode and a use are disclosed.

A cover window includes a plastic layer and a first hard coating layer disposed on an upper surface of the plastic layer. An edge of the cover window includes a vertical side part perpendicular to the upper surface of the plastic layer. A first inclination part is connected to the vertical side part and is inclined with respect to the vertical side part. The vertical side part and the first inclination part include a mechanical processing trace. An edge of the first hard coating layer adjacent to the first inclination part includes a laser processing trace.

A packing bag to store a stored article Z with tight seal by a welded sheet material 1 of resin in which a separation-prepared line portion 5, separable by predetermined tensile force F by human hands to take out the stored article Z, is provided along an opening-prepared side portion 10, the sheet material 1 has a layered unit construction in which first and second welding resin layers 61A and 61B are disposed on both sides, and a barrier layer is disposed on a middle position, the separation-prepared line portion 5 is composed of a half-cut first laser-worked groove 7A concaved on the first welding resin layer 61A and a half-cut second laser-worked groove 7B concaved on the second welding resin layer 61B, and, the first and second laser-worked grooves 7A and 7B are formed barely damaging the barrier layer 60.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.