A laser cleaning system includes a laser cleaning device having a laser rubber-removal assembly having a laser generator, a laser ejector connected with the laser generator, and a position adjustor slidably connected with a loading assembly; and a recycling assembly having a vacuum collector communicated with a recycling processing device; wherein the laser ejector is arranged on the loading assembly through the position adjustor; wherein the laser generator is configured to generate laser beams to remove rubber residues and the position adjustor is configured to adjust locations of the laser ejector; wherein the vacuum collector is configured to collect the rubber residues and the recycling processing device is configured to granulate the collected rubber residues.

A joining method, etc., is provided, suitable for providing improved joining giving attention to the relation between a horn part and a joining member group. A joining machine performs joining of the joining member group (a first joining member and a second joining member). A horn part of a joining processing part applies sound vibration and/or ultrasound vibration to the joining member group via a buffer member. The horn part and the first joining member are each formed of metal. The buffer member has a greater softness than that of the metal that forms the horn part.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active substance provided area A1 in which an electrode active substance layer 24 is provided on a surface of the electrode substrate 22 and including a substrate exposed area A2 in which the electrode active substance layer 24 is not provided and the electrode substrate 22 is exposed, an active substance provided area cutting step for cutting the active substance provided area A1 by a pulse laser, and a substrate exposed area cutting step for cutting the substrate exposed area A2 by the pulse laser. Then, the frequency of the pulse laser in the substrate exposed area cutting step is made to be larger than the frequency of the pulse laser in the active substance provided area cutting step, and the lap rate of the pulse laser in the substrate exposed area cutting step is made to be equal to or more than 90%. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

Structures for a tool surface of a downhole tool are constructed from a metal clay molded in a wet state. The wet state clay is a workable combination that can have a braze alloy grain, a tungsten carbide grain, and a binder. Additional cutting inserts can be embedded in the molded clay. Heat treatment applied to the molded metal clay causing the binder to be combusted and consumed. The braze alloy melts and then cools into a fused state with the tungsten carbide grain therein. The structure can affix to the tool surface of the tool by first being fused and then attached by brazing to the tool. Alternatively, the structure can be positioned in a fusible state adjacent the tool surface. When the heat treatment is applied, the structure fuses together and forms a metallurgical bond with the tool surface of the tool.

A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10.sup.−12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.

Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.

A hinge lid container (10) for consumer articles comprises a box (12) and a hinge lid (14) connected to the box along a hinge line and pivotable about the hinge line between a closed position and an open position. The hinge lid comprises a first lid wall (16) and a lid flap (18) depending from the first lid wall along an edge fold line, the lid flap being folded inward towards the inner surface of the first lid wall. The container is at least partially formed from a blank having a thickness (T), the laminar blank defining an edge fold portion of the container connecting the first lid wall and the lid flap. The inner surface of the edge fold portion defines an ablation area (A) having a length in the longitudinal direction of the edge fold portion and a width (W) extending transversely to said length.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.