A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

The invention relates to a device (100) for an additive manufacture. The device (100) comprises a laser device (110) for machining material using a laser beam (112), said laser device (110) being designed to deflect the laser beam (112) onto a machining region of a workpiece (10); at least one supply device (130) for a supply material, said supply device being designed to supply the supply material to the machining region; and an interferometer (140) which is designed to measure a distance to the workpiece (10) by means of an optical measuring beam (142).

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

The disclosure relates to methods and apparatuses for controlling a cutting process in which a workpiece is cut by a high-energy beam. A process light signal is detected emanating from an interaction region of the high-energy beam with the workpiece in a first wavelength range (Δλ1), in which at least one metallic constituent (Fe, Cr) of the workpiece has at least one emission line, and in a second wavelength range (Δλ2), which differs from the first wavelength range, in which continuum radiation of the workpiece without emission lines is detectable. Vaporization of the at least one metallic constituent (Fe, Cr) is monitored on the basis of an intensity of the process light signal detected in the first wavelength range (Δλ1) and on the basis of an intensity of the process light signal detected in the second wavelength range (Δλ2).

A laser irradiation apparatus includes a laser source configured to emit a laser beam to an object that is being conveyed to allow the object to be irradiated with the laser beam; a rotation detector configured to detect rotation of the object to obtain information on the rotation of the object; and circuitry configured to control laser irradiation onto the object based on the information on the rotation of the object.

Provided is a laser processing machine including a laser head capable of irradiating a workpiece with laser beam, a belt conveyor provided away in an irradiation direction of the laser beam, and a control unit configured to control operations of the laser head and the belt conveyor. The laser head is configured to be movable along at least a rotating direction of the belt conveyor. The control unit is configured to control, in a case where a moving direction and a moving speed of the laser head match the rotating direction and a rotating speed of the belt conveyor during the irradiation with the laser beam, the operation of at least one of the laser head and the belt conveyor in order to avoid the matching.

Embodiments pertain to a system for controlling outputting of light towards objects, the system comprising a detection subsystem configured to detect, for at least one object, one or more values of object characteristics, the object characteristics comprising, at least, electromagnetic absorption characteristics, wherein detection of object characteristic values is performed such that the object remains structurally intact; a light source subsystem comprising at least one light source for generating output light and directing the output light towards an object; and a controller configured to control, based on the detected object characteristics values, at least one operational parameter value of the at least one light source such that at least some of the output light that is directed towards the object has electromagnetic characteristics that correspond to the detected values of the electromagnetic absorption characteristics of the object, in order to structurally change at least part of the respective object.

In forming modification layers by radiating laser light to an inside of a processing target object from a modifying device periodically while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and by moving the modifying device relative to the holder in a diametrical direction by a moving mechanism, a boundary position of the laser light in the diametrical direction is calculated, the boundary position being a position where a circumferential distance between the modification layers becomes a required threshold value, and a diametrical distance between the modification layers is reduced in a moving direction of the modifying device from the boundary position and/or a frequency of the laser light is reduced.

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.