A removable image-capture apparatus (200) comprises an opening (202) intended to receive a calibration plate (10) bearing a reference marking (30) and possibly a test marking (40). The apparatus (200) comprises a source (204) of backlighting visible light situated beneath the opening (202), a sensor (205) for acquiring an image, in the backlighting visible light, of the plate (10), a guiding and supporting device (206) for positioning the sensor (205) above the opening (202) relative to the surround (201), a calculation device (207) configured to analyze the image, recognize the marking (30) and possibly the marking (40) in the image, and calculate aiming-command corrections intended for a firing system firing a powerful incident-radiation beam, which system belongs to an additive manufacturing apparatus, distinct and separate from the apparatus (200).

Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

A machine learning device for learning a focal position offset of a laser processing apparatus. A data acquisition section acquires a learning dataset which includes data of a focal position command for a light-focusing optical system given to the laser processing apparatus and detection data of a physical quantity of light detected when a laser beam is emitted from a laser oscillator in accordance with a processing command including the focal position command. A learning section generates a learning model by using the learning dataset, which represents correlativity between the physical quantity of the detected light and the positional relationship of an effective light-focusing position of the light-focusing optical system relative to a workpiece. When performing processing, the physical quantity of light is detected so that a positional relationship between the workpiece and the effective light-focusing position during processing can be estimated from the detected quantity and the learning model.

A machine learning device for learning a focal position offset of a laser processing apparatus. A data acquisition section acquires a learning dataset which includes data of a focal position command for a light-focusing optical system given to the laser processing apparatus and detection data of a physical quantity of light detected when a laser beam is emitted from a laser oscillator in accordance with a processing command including the focal position command. A learning section generates a learning model by using the learning dataset, which represents correlativity between the physical quantity of the detected light and the positional relationship of an effective light-focusing position of the light-focusing optical system relative to a workpiece. When performing processing, the physical quantity of light is detected so that a positional relationship between the workpiece and the effective light-focusing position during processing can be estimated from the detected quantity and the learning model.

A process for aligning a laser in a gear inspection system is disclosed. The method comprises fixing a gear for inspection within a gear inspection system and emitting a first signal from a laser to a point of interest of the gear. A reflection of the first signal is received as the first signal reflects off the point of interest of the gear. Based on the reflection of the first signal, an orientation of the laser is adjusted. Subsequently, a second signal is emitted from the laser to the point of interest of the gear, and a reflection of the second signal is received as the second signal reflects off the point of interest of the gear. Values corresponding to the orientation of the laser are stored based on the reflection of the second signal.

A process for aligning a laser in a gear inspection system is disclosed. The method comprises fixing a gear for inspection within a gear inspection system and emitting a first signal from a laser to a point of interest of the gear. A reflection of the first signal is received as the first signal reflects off the point of interest of the gear. Based on the reflection of the first signal, an orientation of the laser is adjusted. Subsequently, a second signal is emitted from the laser to the point of interest of the gear, and a reflection of the second signal is received as the second signal reflects off the point of interest of the gear. Values corresponding to the orientation of the laser are stored based on the reflection of the second signal.

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

A laser machining system includes a state measurement unit that observes an internal state of a machining head or a varying state of a workpiece and outputs a machining state signal; an inference unit that determines a degree of quality of the laser beam machining as an inference result for each of machining defects concerning at least one type of machining defect on the basis of the machining state signal; a machining monitoring unit that monitors the workpiece for presence or absence of the machining defect and outputs a monitoring signal; a machining decision unit that decides whether there is the machining defect and determines a quality of the machining as a decision result; and a machinery safety unit that outputs, on the basis of the inference result and the decision result, a control signal that gives an instruction on whether to stop or continue the laser beam machining.