A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

A laser processing device includes an optical scanning unit that scans laser light; a condenser lens that condenses the laser light onto a workpiece; a plasma light sensor that detects plasma light from the workpiece; and a control unit configured to generate processing position data for the laser light for processing the workpiece, wherein the control unit causes the optical scanning unit to scan the laser light and causes the plasma light sensor to acquire a detection result of detecting the plasma light from the workpiece, and the control unit generates the processing position data for the laser light for processing the workpiece on the basis of the detection result.

A laser processing head directs laser energy along an optical axis from a fiber to perform brazing or welding operations. A collimating stage collimates a diverging beam of the laser energy from the fiber into a collimated beam, and a focusing stage focuses the collimated beam into a converging beam to a focus spot for the desired operation. At least one of the stages has a changeable effective focal length for zoom functionality. A freeform refractive optic can be positioned in at least one of the diverging and collimated beams. For example, a freeform refractive optic in a first position is placed out of the diverging beam. However, the freeform refractive optic in a second position placed in the diverging beam can field map or intensity map the diverging beam to produce the mapped diverging beam, which increases an image of the fiber tip to the collimating stage.

A laser processing head directs laser energy along an optical axis from a fiber to perform brazing or welding operations. A collimating stage collimates a diverging beam of the laser energy from the fiber into a collimated beam, and a focusing stage focuses the collimated beam into a converging beam to a focus spot for the desired operation. At least one of the stages has a changeable effective focal length for zoom functionality. A freeform refractive optic can be positioned in at least one of the diverging and collimated beams. For example, a freeform refractive optic in a first position is placed out of the diverging beam. However, the freeform refractive optic in a second position placed in the diverging beam can field map or intensity map the diverging beam to produce the mapped diverging beam, which increases an image of the fiber tip to the collimating stage.

A laminated device wafer forming method includes a laminating step of laminating a first device wafer and a second device wafer to each other, the laminating step including a position adjusting step of imaging, by an imaging unit, a first predetermined line formed on a peripheral portion on the front surface side of the first device wafer and located outside rectangular regions corresponding to devices and a second predetermined line formed on a peripheral portion on the front surface side of the second device wafer and located outside the rectangular regions corresponding to the devices, and adjusting relative positions of the first device wafer and the second device wafer by using the first predetermined line and the second predetermined line.

A laminated device wafer forming method includes a laminating step of laminating a first device wafer and a second device wafer to each other, the laminating step including a position adjusting step of imaging, by an imaging unit, a first predetermined line formed on a peripheral portion on the front surface side of the first device wafer and located outside rectangular regions corresponding to devices and a second predetermined line formed on a peripheral portion on the front surface side of the second device wafer and located outside the rectangular regions corresponding to the devices, and adjusting relative positions of the first device wafer and the second device wafer by using the first predetermined line and the second predetermined line.

Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robot arm (41) in a manner rotatable about axis (RA), and connector component (50) that connects arm tip shaft (J6) and laser head (60). Connector component (50) is provided with gauge attachment portion (51a) to which gauge (80) is attached removably. Gauge (80) has a reference point corresponding to the focal position of laser beam (LB).

A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a wafer. The laser beam applying unit includes a laser oscillator for emitting the laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator into a focused spot and positioning the focused spot in the wafer held on a chuck table, a focused spot position adjuster disposed between the laser oscillator and the beam condenser for adjusting the position of the focused spot, and an upper surface position detector for detecting the position of an upper surface of the wafer. The upper surface position detector includes a first upper surface position detecting unit, a second upper surface position detecting unit, and a selector for selecting either the first upper surface position detecting unit or the second upper surface position detecting unit depending on a feature of the wafer.

A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a wafer. The laser beam applying unit includes a laser oscillator for emitting the laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator into a focused spot and positioning the focused spot in the wafer held on a chuck table, a focused spot position adjuster disposed between the laser oscillator and the beam condenser for adjusting the position of the focused spot, and an upper surface position detector for detecting the position of an upper surface of the wafer. The upper surface position detector includes a first upper surface position detecting unit, a second upper surface position detecting unit, and a selector for selecting either the first upper surface position detecting unit or the second upper surface position detecting unit depending on a feature of the wafer.