A laser processing apparatus includes a laser oscillator that emits a laser beam, a beam condenser that condenses the laser beam emitted by the laser oscillator and positions the condensed point to a wafer, a condensed point position adjuster that is disposed between the laser oscillator and the beam condenser and adjusts the position of the condensed point, and an upper surface position detector that detects the upper surface position of the wafer. The upper surface position detector includes a detection light source that emits detection light of a wide wavelength band and a selector that selects detection light with a specific wavelength from the detection light emitted by the detection light source.

A laser processing apparatus includes a laser oscillator that emits a laser beam, a beam condenser that condenses the laser beam emitted by the laser oscillator and positions the condensed point to a wafer, a condensed point position adjuster that is disposed between the laser oscillator and the beam condenser and adjusts the position of the condensed point, and an upper surface position detector that detects the upper surface position of the wafer. The upper surface position detector includes a detection light source that emits detection light of a wide wavelength band and a selector that selects detection light with a specific wavelength from the detection light emitted by the detection light source.

Laser processing device (1) includes: laser-beam switching apparatus (70) that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (11), the second optical path including second fiber (21) that has a core diameter that is larger than a core diameter of first fiber (11); and processing head (80) that illuminates a same processed point on workpiece (900) with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus (70) switches from the first optical path to the second optical path.

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.

A system for welding a first component to a second component. The system includes a first laser head configured to emit a first laser beam and be movably disposable on a first side of the first component. The system further includes a second laser head configured to emit a second laser beam and be movably disposable on an opposing second side of the first component. The system further includes a controller configured to independently control a first power of the first laser beam and a second power of the second laser beam. The controller is also configured to independently and simultaneously control movement of the first laser head and movement of the second laser head relative to the first component.

A welding method includes: emitting a laser beam to a workpiece including a metal; and welding a portion of the workpiece to which the laser beam is emitted by melting. The laser beam includes a main power region and at least one auxiliary power region, power in the main power region is equal to or higher than power in each of the at least one auxiliary power region, and a power ratio of the power in the main power region and a total of the power in the at least one auxiliary power region is within a range of 144:1 to 1:1.

Collimator lens (21) and focusing lens (22) are provided with AR coating (23). AR coating (23) has a first reflectance for reflecting a first laser light higher than a second reflectance for reflecting a second laser light. Detector (25) detects diffusion light (DL) diffused by collimator lens (21) and focusing lens (22). Detector (25) has a first light receiving sensitivity for receiving the first laser light lower than a second light receiving sensitivity for receiving the second laser light.

Beam splitter (23) is provided with AR coating (24). AR coating (24) has a first reflectance for reflecting a first laser light higher than a second reflectance for reflecting a second laser light. Detector (25) detects reflection light (RL) reflected by beam splitter (23). Detector (25) has a first light receiving sensitivity for receiving the first laser light lower than a second light receiving sensitivity for receiving the second laser light.

A laser hole drilling system. The system includes a laser source that generates a laser beam along an optical axis, a cylindrical lens along the optical axis downstream of the laser source, and a spherical lens downstream of the cylindrical lens, the spherical lens offset from the optical axis to provide an anamorphic optical train to generate an asymmetric teardrop shaped energy distribution at a focal plane.