A laser-machining device comprising a laser-radiation source to generate a laser beam and emit it along an optical path; a beam-splitting unit downstream of the laser-radiation source designed to split the laser beam into a bundle of partial beams; an optical control unit downstream of the beam-splitting unit comprising a reflective optical functional unit formed by an array of reflective microscanners, wherein the optical control unit is designed to select any desired number of partial beams in any desired spatial combination from the bundle of partial beams and direct them onto a workpiece, and to position and/or move at least one of those partial beams within a specified partial-beam scanning region of the respective partial beam using the microscanner of the array of microscanners assigned to the respective partial beam, and methods for laser machining a workpiece.

A wafer producing method includes a peel-off layer forming step of forming a peel-off layer by positioning a focused spot of a laser beam having a wavelength transmittable through an ingot to a depth corresponding to a thickness of the wafer to be produced from the ingot from a first end surface of the ingot and applying the laser beam to the ingot, a first chamfered portion forming step of forming a first chamfered portion by applying, from the first end surface side to a peripheral surplus region of the wafer, a laser beam having a wavelength absorbable by the wafer, a peeling-off step of peeling off the wafer to be produced, and a second chamfered portion forming step of forming a second chamfered portion by applying, from a peel-off surface side of the wafer, the laser beam having a wavelength absorbable by the wafer.

A method of operating an apparatus for laser annealing, includes reducing temporal or spatial coherency of a plurality of laser beams by beam superimposing; and reducing an electric field inner product magnitude of beams having the reduced temporal or spatial coherency by a fly eye lens array to reduce coherency, and/or by modifying a polarization state between the beams by beam superimposing.

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to forming a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure the velocity of the jet; and a position acquisition section configured to acquire information representing a position of the maximum point based on output data of the measuring instrument.

A light source device includes an optical fiber; a beam light source configured to coaxially combine laser beams of different peak wavelengths to generate and emit a wavelength-combined beam; and an optical coupling device configured to allow the wavelength-combined beam emitted from the beam light source to be incident on the optical fiber. The optical coupling device includes a first cylindrical lens configured to focus the wavelength-combined beam in a first plane and having a first focal length, a second cylindrical lens configured to focus the wavelength-combined beam in a second plane and having a second focal length, and a third cylindrical lens having a third focal length greater than the first focal length and configured to focus the wavelength-combined beam in the first plane to be incident on the first cylindrical lens.

A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.

A device for a laser machining system includes a laser beam optics for a machining laser beam with an arrangement of optical elements arranged one after the other in a beam path of the machining laser beam. With respect to a direction of propagation of the machining laser beam, a first outermost optical element of the arrangement of optical elements consists of a material with a thermal conductivity coefficient k.sub.T of 2 W/(m.Math.K) or more.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.

A semiconductor mold laser cleaning device of an embodiment includes a laser generator oscillating a pulsed laser beam, an optical fiber transmitting the laser beam, a laser scanning module processing and transmitting the laser beam received through the optical fiber for cleaning the semiconductor mold, the laser scanning module including a laser beam collimator converting the laser beam scattered at one end of the optical fiber into parallel light, a Galvano laser scanner scanning the laser beam, a focal lens focusing the laser beam scanned by the Galvano laser scanner, and a final irradiation mirror redirecting the laser beam passed through the focal lens to deliver the redirected laser beam to the surface of the semiconductor mold, and a conveyance unit conveying the laser scanner module in an X-axis direction and/or a Y-axis direction such that the entire surface of the semiconductor mold can be cleaned.