B23K26/08

LASER MARKING SYSTEM AND METHOD
20230049111 · 2023-02-16 ·

The present application relates to a laser marking system (100) comprising a laser (110) configured to produce a laser beam, a marking head (130) configured to project the laser beam onto a target, and a negative curvature hollow core fiber (120) configured to transmit the laser beam from the laser (110) to the marking head (130).

Multi-functional ingester system for additive manufacturing

A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

ETCHING OF COATED SUBSTRATE
20230045271 · 2023-02-09 ·

A method for treating a coating on a scrolling substrate by a treatment unit generating a laser beam, the method including producing a pattern including several lines or portions extending in the scrolling direction and/or the direction orthogonal to the scrolling direction, the pattern being repeated to cover treat the surface of the substrate.

DEVICE FOR LASER-BASED HEAT TREATMENT OF A COATING DEPOSITED ON A SUBSTRATE, AND CORRESPONDING SUBSTRATE
20230045341 · 2023-02-09 ·

A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

LASER ADDITIVE MANUFACTURING METHOD FOR PRODUCING POROUS LAYERS

Provided herein are manufacturing methods, e.g., comprising: (1a) forming a layer, including: depositing a starting material including a mixture of a metal and a sacrificial material; and applying a laser beam to the deposited starting material to consolidate the deposited starting material and form the layer; (1b) optionally repeating (1a) one or more times; and (1c) at least partially removing the sacrificial material to form a porous metal part.

System and Method for Laser Cleaning
20230038157 · 2023-02-09 ·

A laser cleaning system includes a laser cleaning device having a laser rubber-removal assembly having a laser generator, a laser ejector connected with the laser generator, and a position adjustor slidably connected with a loading assembly; and a recycling assembly having a vacuum collector communicated with a recycling processing device; wherein the laser ejector is arranged on the loading assembly through the position adjustor; wherein the laser generator is configured to generate laser beams to remove rubber residues and the position adjustor is configured to adjust locations of the laser ejector; wherein the vacuum collector is configured to collect the rubber residues and the recycling processing device is configured to granulate the collected rubber residues.

Ultrafast laser inscribed structures for signal concentration in focal plan arrays

The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.

Ultrafast laser inscribed structures for signal concentration in focal plan arrays

The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.

Device with processing beam source and a guide for processing a filament

One aspect is a device for processing a filament in a process stream, including at least one processing beam source, designed and arranged for emitting at least one processing beam which is suitable for processing a segment of the filament by interaction of the at least one processing beam with the segment of the filament, thereby obtaining a processed filament. The device includes a guide, including a filament feed which is arranged upstream of the at least one processing beam source, and is designed to feed the filament from a feed reel. The guide is designed and arranged to guide the filament so that during the processing the segment of the filament inclines an angle with a vertical axis in the range from 0 to 45°.

Machine for Separative Machining of Plate-Shaped Work Pieces
20180001421 · 2018-01-04 ·

The invention relates to machines and methods for the separative machining of a plate-shaped workpieces. The machine includes a first movement device for moving the workpiece in a first direction (X), a second movement device for moving a machining head, which directs the machining beam onto the workpiece, along a second direction (Y), Between workpiece bearing faces there is formed a gap for the passage of the machining beam. In the machine, mutually facing side edges of at least two of the workpiece bearing faces are oriented non-perpendicularly and non-parallel with respect to the first direction (X).