A laser lapping machine has a platform for supporting and rotating a product, and a laser device for transmitting a laser beam onto the surface of the product. The product may contain polycrystalline diamond, and the platform and the laser device may be configured to move a cutting point along a spiral path across the product surface. A process for removing material, such as polycrystalline diamond material, from a surface of a product is also described. The process includes transmitting a laser beam onto the product surface to remove the material at a cutting point, rotating the product surface relative to the laser beam, and causing the cutting point to move in a radial direction. According to one aspect of the present disclosure, rotation of the platform and radial movement of the laser beam cause the cutting point to move along a spiral path across the product surface.

The present invention relates to a laser welding method of pipe fittings that mainly provides an automated butt welding process for two pipe fittings to be welded, comprising a laser welding device setup step, a material loading step, a first welding step, a second welding step, a third welding step, and a return to the original position step. The welding zone at the butt joint location of the two pipe fittings to be welded is divided to undergo three procedures through the aforementioned steps, using a laser assembly in conjunction with a reflection assembly, to provide a consistent automated butt welding for two pipe fittings to be welded, in order to reduce the time consumed during the butt welding of pipe fittings and increase the speed of the production process.

A laser processing apparatus includes a laser oscillator that emits a laser beam, a beam condenser that condenses the laser beam emitted by the laser oscillator and positions the condensed point to a wafer, a condensed point position adjuster that is disposed between the laser oscillator and the beam condenser and adjusts the position of the condensed point, and an upper surface position detector that detects the upper surface position of the wafer. The upper surface position detector includes a detection light source that emits detection light of a wide wavelength band and a selector that selects detection light with a specific wavelength from the detection light emitted by the detection light source.

Selective laser solidification apparatus is described that includes a powder bed onto which a powder layer can be deposited and a gas flow unit for passing a flow of gas over the powder bed along a predefined gas flow direction. A laser scanning unit is provided for scanning a laser beam over the powder layer to selectively solidify at least part of the powder layer to form a required pattern. The required pattern is formed from a plurality of stripes or stripe segments that are formed by advancing the laser beam along the stripe or stripe segment in a stripe formation direction. The stripe formation direction is arranged so that it always at least partially opposes the predefined gas flow direction. A corresponding method is also described.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

The disclosure relates to methods and systems for joining at least two workpieces, including forming a weld joint by moving a machining beam, e.g., a laser beam, and the at least two workpieces relative to one another along a feed direction, wherein the movement of the machining beam and the two workpieces relative to one another is superimposed with a periodic movement in a movement path, e.g., a two-dimensional movement path, which extends in a transverse direction perpendicularly to the feed direction and, e.g., additionally in the feed direction. The movement path has, between two reversal points in the transverse direction, at least one stop point at which a speed component of the periodic movement in the transverse direction is zero. The invention also relates to computer program products and systems for carrying out the methods.

The disclosure relates to methods and systems for joining at least two workpieces, including forming a weld joint by moving a machining beam, e.g., a laser beam, and the at least two workpieces relative to one another along a feed direction, wherein the movement of the machining beam and the two workpieces relative to one another is superimposed with a periodic movement in a movement path, e.g., a two-dimensional movement path, which extends in a transverse direction perpendicularly to the feed direction and, e.g., additionally in the feed direction. The movement path has, between two reversal points in the transverse direction, at least one stop point at which a speed component of the periodic movement in the transverse direction is zero. The invention also relates to computer program products and systems for carrying out the methods.

A system includes an orientation determination system comprising a camera where the camera is configured to capture an image of an orientation feature of a physical dental model of a dental arch of a customer with material thermoformed thereon. The orientation determination system is configured to identify an offset of the physical dental model with respect to a fixture plate during positioning or before or after the physical dental model is positioned on the fixture plate by determining an actual orientation of the physical dental model based on the orientation feature. The system also includes a laser trimming system configured to cut the material along a trim line based on the identified offset while the fixture plate is moved about at least two axes to produce a dental aligner specific to the customer and being configured to reposition one or more teeth of the customer.

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.