In one embodiment, a semiconductor manufacturing apparatus includes a reformed layer former configured to partially reform a first substrate to form a reformed layer between first and second portions in the first substrate, a peeling layer former configured to form a peeling layer between the second portion and a second substrate provided on the first substrate, and a remover configured to remove the second portion from the second substrate while causing the first portion to remain on the second substrate. The remover includes a heater to heat the first or second portion, to peel the second portion from the second substrate at the peeling layer and divide the first and second portions from each other, and a mover to move the second substrate relative to the second portion, to remove the second portion from the second substrate while causing the first portion to remain on the second substrate.

In one embodiment, a semiconductor manufacturing apparatus includes a reformed layer former configured to partially reform a first substrate to form a reformed layer between first and second portions in the first substrate, a peeling layer former configured to form a peeling layer between the second portion and a second substrate provided on the first substrate, and a remover configured to remove the second portion from the second substrate while causing the first portion to remain on the second substrate. The remover includes a heater to heat the first or second portion, to peel the second portion from the second substrate at the peeling layer and divide the first and second portions from each other, and a mover to move the second substrate relative to the second portion, to remove the second portion from the second substrate while causing the first portion to remain on the second substrate.

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).

A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

An alignment adjuster includes a first holder made of a first material and configured to support an optical element, a first adjuster including a first expandable/contractable section made of a second material different from the first material and configured to rotate the first holder and the optical element around a first axis by adjusting the length of the first expandable/contractable section with the first expandable/contractable section being in contact with the first holder, and a first support member made of the second material and configured to support the first adjuster, and the first adjuster is configured to be capable of adjusting the position where the first expandable/contractable section and the first holder are in contact with each other to be located in a first plane containing a first end section of the first support member and the first axis.

An alignment adjuster includes a first holder made of a first material and configured to support an optical element, a first adjuster including a first expandable/contractable section made of a second material different from the first material and configured to rotate the first holder and the optical element around a first axis by adjusting the length of the first expandable/contractable section with the first expandable/contractable section being in contact with the first holder, and a first support member made of the second material and configured to support the first adjuster, and the first adjuster is configured to be capable of adjusting the position where the first expandable/contractable section and the first holder are in contact with each other to be located in a first plane containing a first end section of the first support member and the first axis.

In order to create a laser tool, in particular for the structuring of cylinder running surfaces, that offers the possibility of adjusting the focal position of the laser beam with high process reliability and with high repeatability, it is provided that the laser tool has a laser source for producing laser beams, a collimator for producing a parallel course of the laser beams from the laser source, which are passed through a lens that is located within a rotatable spindle, wherein an optical device for deflecting the laser beams onto a material surface is attached to an end of the spindle facing away from the laser source, wherein the collimator is movable parallel to the laser beam by means of a drive.

A frame like structure supporting a laser engraving machine between left and right vertically adjustable pedestal. Each pedestal is mounted to a set of vertically oriented screw shafts wherein at least one shaft on each side frame is driven by a stepper motor connected to the screw shaft adjacent the bottom end thereof. Manually operated locks are provided at the tops of the screw shaft to prevent inadvertent rotation caused by the weight of the engraving machine in the event of a motor failure. The pairs of screw shafts on each side of the frame are coupled by belts to permit one motor to rotate both shafts and one lock to lock both shafts.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas, to minimize deleterious surface modifications and mitigate the oxide formation associated with laser machining.