Method for producing a precoated steel blank including the successive steps of: —providing a precoated steel strip including a steel substrate having, on at least one of its main faces, a precoating, the precoating including an intermetallic alloy layer and a metallic layer extending atop said intermetallic alloy layer, the metallic layer being a layer of aluminum, a layer of aluminum alloy or a layer of aluminum-based alloy, —laser cutting the precoated steel strip in order to obtain at least one precoated steel blank, the precoated steel blank including a laser cut edge surface resulting from the laser cutting operation, the laser cut edge surface including a substrate portion and a precoating portion, wherein the laser cutting is carried out in such a way that the substrate portion of the laser cut edge directly resulting from the cutting operation has an oxygen content greater than or equal to 15% in weight.

A laser machining method able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. A laser machining method for cutting a workpiece W by using a machining head able to emit a laser beam and an assist gas coaxially and non-coaxially includes: preparing a machining program specifying, for the workpiece W, a cutting line, and a first region and a second region on both sides of the cutting line where cutting quality requirements are different; and maintaining a state in which a center axis of the assist gas is shifted from an optical axis of the laser beam toward the first region in response to the difference in the cutting quality requirements during the cutting between the first region and the second region along the cutting line in accordance with the machining program.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; a substrate support unit provided in the treating space; a window provided at a top of the chamber; and an optical module provided over the window and configured to transmit a laser beam to a substrate through the window, and wherein the optical module includes: a homogenizing optics configured to homogenize the laser beam to a uniform beam profile; and an imaging optics configured to control the size of the laser beam.

A processing method of a workpiece used when the workpiece is processed is provided. The processing method of a workpiece includes a disposing step of disposing the workpiece in a gas containing a substance that generates an active species that reacts with the workpiece, a measurement step of measuring the distribution of the thickness of the workpiece disposed in the gas, and a laser beam irradiation step of irradiating the workpiece in the gas with a laser beam of which the power is adjusted based on the distribution of the thickness measured in the measurement step. In the laser beam irradiation step, the removal amount by which a region irradiated with the laser beam in the workpiece is removed by the active species is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.

A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.

A laser processing system includes: a wavelength-variable laser device configured to output each of a laser beam at an absorption line as a wavelength at which light is absorbed by oxygen and a laser beam at a non-absorption line as a wavelength at which the amount of light absorption by oxygen is smaller than at the absorption line; an optical system configured to irradiate a workpiece with the laser beam; and a laser control unit configured to control the wavelength-variable laser device, set the wavelength of the laser beam output from the wavelength-variable laser device to be the non-absorption line when laser processing is performed on the surface of the workpiece in gas containing oxygen, and set the wavelength of the laser beam output from the wavelength-variable laser device to be the absorption line when ozone cleaning is performed on the surface of the workpiece in gas containing oxygen.

A method comprising the steps of: distributing a titanium alloy or pure titanium powder layer on a work table inside a vacuum chamber, directing at least one electron beam from at least one electron beam source over the work table causing the powder layer to fuse in selected locations, distributing a second powder layer on the work table of a titanium alloy or pure titanium inside the build chamber, directing the at least one electron beam over the work table causing the second powder layer to fuse in selected locations, and releasing a predefined concentration of the gas from the metal powder into the vacuum chamber when at least one of heating or fusing the metal powder layer, wherein at least one gas comprising hydrogen is absorbed into or chemically bonded to the titanium or titanium alloy powder to a concentration of 0.01-0.5% by weight of the hydrogen.

A method for forming a three-dimensional article through successive fusion of parts of a metal powder bed is provided, comprising the steps of: distributing a first metal powder layer on a work table inside a build chamber, directing at least one high energy beam from at least one high energy beam source over the work table causing the first metal powder layer to fuse in selected locations, distributing a second metal powder layer on the work table, directing at least one high energy beam over the work table causing the second metal powder layer to fuse in selected locations, introducing a first supplementary gas into the build chamber, which first supplementary gas comprising hydrogen, is capable of reacting chemically with or being absorbed by a finished three-dimensional article, and releasing a predefined concentration of the gas which had reacted chemically with or being absorbed by the finished three dimensional article.

According to one embodiment, a welding method includes preparing a welding member that includes aluminum. The welding method includes welding a weld area of a surface of the welding member by irradiating a laser on the weld area in a state in which a gas including oxygen is supplied to the weld area. A concentration of the oxygen in the gas is not less than 1.5 vol % and not more than 10 vol %. The weld area includes aluminum oxide after the irradiating of the laser.

Provided is a method of manufacturing a semiconductor device. The method of manufacturing a semiconductor device includes forming a target etching layer on a substrate, patterning the target etching layer to form a pattern layer including a pattern portion having a first height and a first width and a recess portion having a second width, providing a first gas and a second gas on the pattern layer, and performing a reaction process including reacting the first and second gases with a surface of the pattern portion by irradiating a laser beam on the pattern layer. The performing the reaction process includes removing a portion of sidewalls of the pattern portion so that the pattern portion has a third width that is smaller than the first width.