Patent classifications
B23K26/1436
Laser processing system, jet observation apparatus , laser processing method, and jet observation method
A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to forming a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure the velocity of the jet; and a position acquisition section configured to acquire information representing a position of the maximum point based on output data of the measuring instrument.
Laser cutting and machining method for plated steel plate, laser cut-and-machined product, thermal cutting and machining method, thermal cut-and-machined product, surface-treated steel plate, laser cutting method, and laser machining head
A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.
Laser cutting method for plated steel sheet, laser processing head and laser processing device
Laser cutting on a plated steel sheet is executed by cutting the plated steel sheet by irradiating the plated steel sheet covered with a plate metal with laser light at a wavelength in a 1 micrometer band; and emitting assist gas onto a cut surface of the plated steel sheet, the cut surface being formed in the step of cutting, to make the plate metal fused by irradiation of the laser light flow to the cut surface so as to cover the cut surface with the plate metal.
APPARATUS FOR A LASER WELDING SYSTEM
A laser welding system for welding a component and reducing defects in the weld by ensuring uniform, laminar gas flow over a process area of the system. The laser welding system comprises a laser for welding the component, a platform for supporting the component, an enclosure surrounding the platform, a first actuatable barrier, a second actuatable barrier, an actuator, and a controller. The enclosure includes a plurality of walls, one of the walls having an inlet and another wall having an outlet. The inlet and outlet each having an opening having a cross-sectional area for letting gas flow through. The first and second barriers are configured to modify the cross-sectional areas of the openings when actuated. The actuator is configured to actuate the barriers, and the controller is configured to direct the actuator to actuate the barriers so that the cross-sectional area of the first opening is larger than the cross-sectional area of the second opening so that a pressure at the inlet is greater than a pressure at the outlet.
Laser processing system, and laser processing method
A laser processing system capable of reliably determining an abnormality in a jet during laser process. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure any of the velocity of the jet and a sound generated by the jet impinging on a workpiece; and an abnormality determination section configured to determine whether or not output data of the measuring instrument is different from reference data.
IN-SITU LASER REDEPOSITION REDUCTION BY A CONTROLLED GAS FLOW AND A SYSTEM FOR REDUCING CONTAMINATION
Deposition of debris produced in laser ablation of a workpiece situated in a vacuum chamber is reduced by introduction a background gas into the vacuum chamber prior to or during laser ablation. The background gas can be introduced diffusely into the vacuum chamber and can reduce contamination of surfaces such as a surface of an optical window that faces the workpiece during processing. Directed introduction of a background gas can be used as well and in some cases the same or a different background gas is directed to a workpiece surface at the same or different pressure than that associated with diffuse introduction of the background gas to reduce contamination of the workpiece surface with laser ablation debris.
Method for Controlling Stress in a Substrate During Laser Deposition
The invention relates to a method for controlling stress in a substrate during laser deposition. The method includes the steps of: providing a laser deposition device including a chamber with a target holder with a target, a substrate holder with a substrate facing the target and a window, the laser deposition device further including a laser beam directed through the window of the chamber onto a spot at the target for generating a plasma plume of target material and depositing the target material onto a surface portion of the substrate in order to form a thin film of target material, wherein the target spot is movable relative to the substrate in order to deposit target material onto a plurality of surface portions of the substrate; defining a plurality of discrete surface portions on the substrate; aligning the target spot one after the other with each of the plurality of discrete surface portions and generating a plasma plume to deposit target material on each of the plurality of discrete surface portions; and adjusting at least one of the parameters of the deposition process depending on the discrete surface portion with which the target spot is aligned, which parameters include temperature, pressure, laser beam pulse duration, laser beam power, distance of target to substrate.
SYSTEM AND METHOD FOR AUTOMATED LASER ABLATION
A system and method for automated laser ablation includes an end effector for performing laser ablation at a location with restricted access. The systems and methods of the present disclosure specifically provide for a miniature laser end effector which may be inserted through a port or bore in order to ablate the surface of an internal component of a complex assembly. In several embodiments of the present subject matter, the end effector is mounted on a machine and coupled to a laser system.
APPARATUS FOR PROCESSING GLASS LAMINATE SUBSTRATE AND PROCESSING AND CUTTING METHODS USING THE SAME
A method of processing a glass laminate substrate includes carrying a glass laminate substrate including a glass substrate on a metal substrate to a processing location; radiating a laser onto the metal substrate through the glass substrate; and cooling a portion of the glass substrate, through which the laser is radiated, such that the glass substrate is cut at the portion through which the laser is radiated. When methods of processing and cutting a glass laminate substrate and an apparatus for processing a glass laminate substrate, according to embodiments, are used, a glass laminate substrate having high edge strength after cutting may be produced.
NOZZLE FOR LASER MACHINING AND LASER MACHINING APPARATUS
A nozzle for laser machining is provided with a flange portion and formed in an annular shape, and includes a first communication hole communicating between a first end portion and a second end portion on a side opposite to the first end portion, a circumferential groove portion provided between the flange portion and the second end portion, and a plurality of second communication holes communicating between a surface of the flange portion on a first end portion side and a side surface of the circumferential groove portion on the first end portion side. A side surface of the circumferential groove portion on a second end portion side extends so that the plurality of second communication holes are invisible from the second end portion side.