A laser welding method is usable to weld a material containing copper as a main component. The laser welding method includes heating the material by irradiation with a first laser light and welding the material by irradiation of a portion, which has been irradiated with the first laser light, of the material with a second laser light with which an energy absorption rate of the copper contained in the material increases by an increase in a temperature of the material. A wavelength of the first laser light is 400 nm to 470 nm.

A cable connector assembly includes: an electrical connector; and a cable electrically connected with the electrical connector, the cable including plural high-speed wires for transmitting high-speed signal, a pair of low-speed wires for transmitting low-speed signal, a pair of power wires for transmitting power signal, a pair of standby wires, a detection wire for transmitting detection signal, and a power supply wire; wherein the pair of standby wires, the detection wire, and the power supply wire are arranged in a line along a horizontal direction; the high-speed wires are evenly distributed on both sides of the line along a thickness direction vertical to the horizontal direction; the low-speed wires are disposed on a side of the line along the thickness direction; and the power wires are disposed on another side of the line along the thickness direction.

A cable connector assembly includes: an electrical connector; and a cable electrically connected with the electrical connector, the cable including plural high-speed wires for transmitting high-speed signal, a pair of low-speed wires for transmitting low-speed signal, a pair of power wires for transmitting power signal, a pair of standby wires, a detection wire for transmitting detection signal, and a power supply wire; wherein the pair of standby wires, the detection wire, and the power supply wire are arranged in a line along a horizontal direction; the high-speed wires are evenly distributed on both sides of the line along a thickness direction vertical to the horizontal direction; the low-speed wires are disposed on a side of the line along the thickness direction; and the power wires are disposed on another side of the line along the thickness direction.

The present invention benefits from the determination that pre-selected spectral bandwidths that avoid the spectrum of an electronic transition of a metal/alloy vapor allow for welds substantially free from detritus that may discolor the weld. Accordingly, the present invention provides analytical methods, welding methods and fiber lasers configured to provide high quality metal/alloy welds.

The present invention benefits from the determination that pre-selected spectral bandwidths that avoid the spectrum of an electronic transition of a metal/alloy vapor allow for welds substantially free from detritus that may discolor the weld. Accordingly, the present invention provides analytical methods, welding methods and fiber lasers configured to provide high quality metal/alloy welds.

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

The invention relates to a method for thermally stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

The invention relates to a method for thermally stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

A method for stripping a rod-shaped conductor using laser radiation is provided. The rod-shaped conductor includes an electrically conductive core and a coating that is at least partially transparent to the laser radiation. The method includes traversing the conductor for a first time with at least one laser beam to at least partially reduce transparency of the coating, and traversing the conductor for a second time with the at least one laser beam to at least partially reduce adhesion of the coating.