Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; the second thin film laminate includes at least one third thin film layer and at least one fourth thin film layer, which are laminated on the second region; reflectance or absorptivity of the first thin film laminate with respect to laser is different from reflectance or absorptivity of the second thin film laminate; and the bonding temperature varies according to the quantity of laser light.

The present specification relates to a joint body of different materials, and a method of manufacturing the same. The joint body includes a metal layer; and a resin layer provided on and in contact with one surface of the metal layer. The metal layer comprises two or more etching grooves and two or more burrs provided on a surface of the metal layer adjacent to the etching grooves.

An article is produced by welding a first piece to a second piece by a laser beam. The first piece includes an open cavity and a first sealing surface. The second piece has a second sealing surface. The first piece and second piece are inside chamber with a controllable internal pressure that is changed to cause a flow of a gas from the open cavity. The open cavity is closed by moving at least one of the pieces. The first sealing surface forms a partially gas tight preliminary joint with the second sealing surface. The first piece and the second piece define an interface. The chamber is opened after the preliminary joint has been formed. A welded seam is formed by focusing a laser beam to the interface after the chamber is opened. The first sealing surface and the second sealing surface are substantially planar.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

An ignition coil includes a not-illustrated coil, a plate assembly, and a case assembly. The plate assembly and the case assembly are combined with each other by laser welding at a recess and a rib (projection) which are respective abutting portions, thereby forming storage spaces for storing the coil.

An ignition coil includes a not-illustrated coil, a plate assembly, and a case assembly. The plate assembly and the case assembly are combined with each other by laser welding at a recess and a rib (projection) which are respective abutting portions, thereby forming storage spaces for storing the coil.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A method for joining dissimilar materials includes forming a first recess and a second recess by irradiating a surface of a first member with laser light, the first recess and the second recess being cut into the surface obliquely at angles different from each other, and joining the second member to the surface of the first member with a part of the second member engaging with each of the first recess and the second recess by melting the part of the second member lower in melting point than the first member to cause the part of the second member to flow into each of the first recess and the second recess and solidifying the part of the second member.