A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.

The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.

The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.

Disclosed herein is a laser-gas hybrid cutting system. The laser-gas hybrid cutting system includes: a first cutting means coupled to a gantry or arm, provided to be transferable, and configured to enable the cutting of a workpiece using a laser; and a second cutting means provided on one side of the first cutting means so that an angle or distance can be varied with respect to a workpiece, and configured to enable the cutting of a workpiece using a gas together with the first cutting means. In this case, the gas used in the second cutting means is any one of hydrogen, oxygen, liquefied petroleum gas, and liquefied natural gas.

A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

A method for manufacturing at least a metallic portion of a component: a) depositing metallic material layer by layer onto at least one building platform; b) locally fusing and/or sintering the material layer by layer by supplying energy by at least one high-energy beam in the region of a buildup and joining zone to form at least a portion of at least one component layer of the component portion and/or of the component; c) lowering the building platform layer by layer by a predefined layer thickness; and d) repeating the steps a) through c) until completion of the component portion and/or of the component. Before, during and/or after process step b), at least one further portion of the component layer is formed by locally fusing and/or sintering the material by inductive heating at a temperature or in a temperature range above the solidus temperature of the metallic material used. A system for manufacturing at least a portion of a component is also provided.

A method for manufacturing at least a metallic portion of a component: a) depositing metallic material layer by layer onto at least one building platform; b) locally fusing and/or sintering the material layer by layer by supplying energy by at least one high-energy beam in the region of a buildup and joining zone to form at least a portion of at least one component layer of the component portion and/or of the component; c) lowering the building platform layer by layer by a predefined layer thickness; and d) repeating the steps a) through c) until completion of the component portion and/or of the component. Before, during and/or after process step b), at least one further portion of the component layer is formed by locally fusing and/or sintering the material by inductive heating at a temperature or in a temperature range above the solidus temperature of the metallic material used. A system for manufacturing at least a portion of a component is also provided.

A method and apparatus for direct writing of single crystal super alloys and metals. The method including heating a substrate to a predetermined temperature below its melting point; using a laser to form a melt pool on a surface of the substrate, wherein the substrate is positioned on a base plate, and wherein the laser and the base plate are movable relative to each other, the laser being used for direct metal deposition; introducing a superalloy powder to the melt pool; and controlling the temperature of the melt pool to maintain a predetermined thermal gradient on a solid and liquid interface of the melt pool so as to form a single crystal deposit on the substrate. The apparatus configured to generally achieve the aforementioned method.