A method for quality inspection of laser material processing includes performing laser material processing on a workpiece and generating, by a sensor, raw image data of secondary emissions during the laser material processing of the workpiece. The method also includes determining a quality of the laser material processing by analyzing the raw image data of the secondary emissions.

A method for quality inspection of laser material processing includes performing laser material processing on a workpiece and generating, by a sensor, raw image data of secondary emissions during the laser material processing of the workpiece. The method also includes determining a quality of the laser material processing by analyzing the raw image data of the secondary emissions.

The present disclosure provides methods and systems for composite-to-metal hybrid bonded structures compromising the laser surface treatment on titanium alloys to promote adhesive bond performance. For example, a computer may be programmed to set a laser path corresponding to a predetermined geometric pattern. A laser may be coupled to the computer and apply a pulsed laser beam to a contact surface of the titanium alloy along the predefined geometric pattern. The laser may generate an open pore oxide layer on the contact surface of the substrate with a thickness of 100 and 500 nm. The open pore oxide layer may have a topography corresponding to the predefined geometric pattern. The topography may contain high degree of open pore structure and promote adhesive bond performance. Adhesive, primer or composite resin matrix may fully infiltrate into the open pore structures. Adhesive and composite laminate may co-cure to form composite-to-titanium hybrid bonded structures.

The cutting station (1) for profiled elements, particularly for window and door frames, comprises one basic structure (2), one line of movement (3, 4) of one profiled element (P) associated with the basic structure (2) and adapted to move the profiled element (P) along a direction of movement (D) in order to displace it with respect to the basic structure (2), and one cutting assembly (5) associated with the basic structure (2), arranged along the direction of movement (D) and adapted to cut the profiled element (P) according to at least one angle of width comprised between 10° and 170° with respect to the longitudinal direction to obtain at least two portions of profiled element (P1, P2), wherein the station (1) comprises one laser marking assembly (22) associated with said basic structure (2) and adapted to emit one laser beam (R) towards the profiled element (P) in order to engrave one identification mark on the profiled element itself.

A method for treating a coating on a scrolling substrate by a treatment unit generating a laser beam, the method including producing a pattern including several lines or portions extending in the scrolling direction and/or the direction orthogonal to the scrolling direction, the pattern being repeated to cover treat the surface of the substrate.

A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

A semiconductor mold laser cleaning device of an embodiment includes a laser generator oscillating a pulsed laser beam, an optical fiber transmitting the laser beam, a laser scanning module processing and transmitting the laser beam received through the optical fiber for cleaning the semiconductor mold, the laser scanning module including a laser beam collimator converting the laser beam scattered at one end of the optical fiber into parallel light, a Galvano laser scanner scanning the laser beam, a focal lens focusing the laser beam scanned by the Galvano laser scanner, and a final irradiation mirror redirecting the laser beam passed through the focal lens to deliver the redirected laser beam to the surface of the semiconductor mold, and a conveyance unit conveying the laser scanner module in an X-axis direction and/or a Y-axis direction such that the entire surface of the semiconductor mold can be cleaned.

A cleaning method involves, in a first step, emitting a first laser light toward the surface of a steel material targeted for cleaning to clean the surface of the steel material. Next, in a second step, a second laser light is emitted toward the surface of the steel material to remove an oxide layer formed on the surface of the steel material due to irradiation with the first laser light. In this step, the oxide layer formed on the surface of the steel material is removed, by emitting the second laser light at a power in a range that does not cause a new oxide layer to form on the surface of the steel material.