A laser cleaning system includes a laser cleaning device having a laser rubber-removal assembly having a laser generator, a laser ejector connected with the laser generator, and a position adjustor slidably connected with a loading assembly; and a recycling assembly having a vacuum collector communicated with a recycling processing device; wherein the laser ejector is arranged on the loading assembly through the position adjustor; wherein the laser generator is configured to generate laser beams to remove rubber residues and the position adjustor is configured to adjust locations of the laser ejector; wherein the vacuum collector is configured to collect the rubber residues and the recycling processing device is configured to granulate the collected rubber residues.

A laser cleaning system includes a laser cleaning device having a laser rubber-removal assembly having a laser generator, a laser ejector connected with the laser generator, and a position adjustor slidably connected with a loading assembly; and a recycling assembly having a vacuum collector communicated with a recycling processing device; wherein the laser ejector is arranged on the loading assembly through the position adjustor; wherein the laser generator is configured to generate laser beams to remove rubber residues and the position adjustor is configured to adjust locations of the laser ejector; wherein the vacuum collector is configured to collect the rubber residues and the recycling processing device is configured to granulate the collected rubber residues.

The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).

The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

An image calibration inspection tool includes: a plurality of substantially rectangular markers, two orthogonal sides of which are connected by an arc-shaped curve; and a calibration chart in which the plurality of markers are formed on a metal plate through machining, laser marking, or the like, wherein two of the markers in a diagonal direction are separated by a predetermined distance.

A cover window includes a plastic layer and a first hard coating layer disposed on an upper surface of the plastic layer. An edge of the cover window includes a vertical side part perpendicular to the upper surface of the plastic layer. A first inclination part is connected to the vertical side part and is inclined with respect to the vertical side part. The vertical side part and the first inclination part include a mechanical processing trace. An edge of the first hard coating layer adjacent to the first inclination part includes a laser processing trace.

Method of controlling a laser marking matrix system, the matrix system comprising an N×M matrix of lasers to produce the laser marking, the method comprising the sequential transformation of at least two images to be marked into a series of marking commands according to an N×M matrix of dots, which comprises the following phases: division of a first image into a fixed portion and a variable portion, transformation of the fixed portion into a fixed matrix and the variable portion into a variable matrix, combination of said fixed and variable matrices, laser marking of the first image, processing of a second image, obtaining a new variable matrix which is added to the previous fixed matrix, producing a complete new matrix, laser marking of the second image.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).