Embodiments of the present disclosure relate to methods for controlling etch depth by providing localized heating across a substrate. The method for controlling temperatures across the substrate can include individually controlling a plurality of heating pixels disposed in a dielectric body of a substrate support assembly. The plurality of heating pixels provide temperature distributions on a first surface of the substrate disposed on a support surface of the dielectric body. The temperature distributions correspond to a plurality of portions of at least one grating on a second surface of the substrate to be exposed to an ion beam. Additionally, the temperatures can be controlled by individually controlling light emitting diodes (LEDs) of LED arrays. The substrate is exposed to the ion beam to form a plurality of fins on the at least one grating. The at least one grating has a distribution of depths corresponding to the temperature distributions.

Embodiments of the present disclosure relate to methods for controlling etch depth by providing localized heating across a substrate. The method for controlling temperatures across the substrate can include individually controlling a plurality of heating pixels disposed in a dielectric body of a substrate support assembly. The plurality of heating pixels provide temperature distributions on a first surface of the substrate disposed on a support surface of the dielectric body. The temperature distributions correspond to a plurality of portions of at least one grating on a second surface of the substrate to be exposed to an ion beam. Additionally, the temperatures can be controlled by individually controlling light emitting diodes (LEDs) of LED arrays. The substrate is exposed to the ion beam to form a plurality of fins on the at least one grating. The at least one grating has a distribution of depths corresponding to the temperature distributions.

A drill device includes a drill tip and a drill body having a rear portion. The drill tip includes at least a first clearance surface and the drill body includes at least a first land having a margin. An edge is disposed between the first clearance surface and the margin. A textured area having a plurality of recesses extends along at least a portion of the margin, in the direction of the rear portion of the drill body, from a position of 200 μm from the edge, from a position on the least first clearance surface, or from a position therebetween.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

Provided is an oriented electrical steel sheet including a groove existing on the surface of the electrical steel sheet and a forsterite layer formed on a part or all of the surface of the electrical steel sheet, in which forsterite which is extended from the forsterite layer and penetrates to a base steel sheet in an anchor form is present on the surface of the side of the groove.

A packing bag to store a stored article Z with tight seal by a welded sheet material 1 of resin in which a separation-prepared line portion 5, separable by predetermined tensile force F by human hands to take out the stored article Z, is provided along an opening-prepared side portion 10, the sheet material 1 has a layered unit construction in which first and second welding resin layers 61A and 61B are disposed on both sides, and a barrier layer is disposed on a middle position, the separation-prepared line portion 5 is composed of a half-cut first laser-worked groove 7A concaved on the first welding resin layer 61A and a half-cut second laser-worked groove 7B concaved on the second welding resin layer 61B, and, the first and second laser-worked grooves 7A and 7B are formed barely damaging the barrier layer 60.

A packing bag to store a stored article Z with tight seal by a welded sheet material 1 of resin in which a separation-prepared line portion 5, separable by predetermined tensile force F by human hands to take out the stored article Z, is provided along an opening-prepared side portion 10, the sheet material 1 has a layered unit construction in which first and second welding resin layers 61A and 61B are disposed on both sides, and a barrier layer is disposed on a middle position, the separation-prepared line portion 5 is composed of a half-cut first laser-worked groove 7A concaved on the first welding resin layer 61A and a half-cut second laser-worked groove 7B concaved on the second welding resin layer 61B, and, the first and second laser-worked grooves 7A and 7B are formed barely damaging the barrier layer 60.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A foreign substance capturing apparatus according to an embodiment of the present invention may comprise: a capturing body unit having an inlet port for introducing the air including magnetic foreign substances and an outlet port for discharging the air from which the magnetic foreign substances have been removed; and a magnetic isolation unit connected to the capturing body unit, including a magnetic member for isolating, by an attractive force, the magnetic foreign substances from the air flowing in the capturing body unit, and provided with a non-magnetic member surrounding the magnetic member.