According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active material provided area A1 in which an electrode active material layer 24 is provided on a surface of the electrode core 22 and including a core exposed area A2 in which the electrode active material layer 24 is not provided and the electrode core 22 is exposed, and an active material provided area cutting step for cutting the active material provided area A1 by a pulse laser, and a core exposed area cutting step for cutting the core exposed area A2 by the pulse laser. Then, in the case where the pulse width (ns) of the pulse laser is represented by X and the lap rate (%) is represented by Y for the core exposed area cutting step, a condition represented by Y≥−3log X+106 is satisfied. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

A device for a laser machining system includes a laser beam optics for a machining laser beam with an arrangement of optical elements arranged one after the other in a beam path of the machining laser beam. With respect to a direction of propagation of the machining laser beam, a first outermost optical element of the arrangement of optical elements consists of a material with a thermal conductivity coefficient k.sub.T of 2 W/(m.Math.K) or more.

A device for a laser machining system includes a laser beam optics for a machining laser beam with an arrangement of optical elements arranged one after the other in a beam path of the machining laser beam. With respect to a direction of propagation of the machining laser beam, a first outermost optical element of the arrangement of optical elements consists of a material with a thermal conductivity coefficient k.sub.T of 2 W/(m.Math.K) or more.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.

The present invention relates to a computer-implemented method and a planer for calculating at least one supplementary processing plan for a workpiece to be processed by a processing machine. The method comprises the steps of: Measuring workpiece properties, including a thickness parameter of the workpiece; Providing at least one supplementary processing plan, which is specific for the measured workpiece properties. Due to the present invention, measurement of the workpiece properties is performed before starting to process the workpiece. Therefore, time and material can be saved, and scrap and waste are reduced.

The present invention relates to a computer-implemented method and a planer for calculating at least one supplementary processing plan for a workpiece to be processed by a processing machine. The method comprises the steps of: Measuring workpiece properties, including a thickness parameter of the workpiece; Providing at least one supplementary processing plan, which is specific for the measured workpiece properties. Due to the present invention, measurement of the workpiece properties is performed before starting to process the workpiece. Therefore, time and material can be saved, and scrap and waste are reduced.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).