A wafer producing method includes a peel-off layer forming step of forming a peel-off layer by positioning a focused spot of a laser beam having a wavelength transmittable through an ingot to a depth corresponding to a thickness of the wafer to be produced from the ingot from a first end surface of the ingot and applying the laser beam to the ingot, a first chamfered portion forming step of forming a first chamfered portion by applying, from the first end surface side to a peripheral surplus region of the wafer, a laser beam having a wavelength absorbable by the wafer, a peeling-off step of peeling off the wafer to be produced, and a second chamfered portion forming step of forming a second chamfered portion by applying, from a peel-off surface side of the wafer, the laser beam having a wavelength absorbable by the wafer.

A wafer producing method includes a peel-off layer forming step of forming a peel-off layer by positioning a focused spot of a laser beam having a wavelength transmittable through an ingot to a depth corresponding to a thickness of the wafer to be produced from the ingot from a first end surface of the ingot and applying the laser beam to the ingot, a first chamfered portion forming step of forming a first chamfered portion by applying, from the first end surface side to a peripheral surplus region of the wafer, a laser beam having a wavelength absorbable by the wafer, a peeling-off step of peeling off the wafer to be produced, and a second chamfered portion forming step of forming a second chamfered portion by applying, from a peel-off surface side of the wafer, the laser beam having a wavelength absorbable by the wafer.

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to forming a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure the velocity of the jet; and a position acquisition section configured to acquire information representing a position of the maximum point based on output data of the measuring instrument.

Provided is a method for forming an implant with an autonomous manufacturing device. The method includes accessing a first computer-readable reconstruction of a being's anatomy; accessing a second computer-readable reconstruction of an implant; accessing a third computer-readable reconstruction comprising the first computer-readable reconstruction superimposed with the second computer readable reconstruction; generating at least one computer-readable trace from a point cloud; and forming an implant with an autonomous manufacturing device, wherein the autonomous manufacturing device forms the implant into a shape defined by at least one dimension of the computer-readable trace.

Provided is a method for forming an implant with an autonomous manufacturing device. The method includes accessing a first computer-readable reconstruction of a being's anatomy; accessing a second computer-readable reconstruction of an implant; accessing a third computer-readable reconstruction comprising the first computer-readable reconstruction superimposed with the second computer readable reconstruction; generating at least one computer-readable trace from a point cloud; and forming an implant with an autonomous manufacturing device, wherein the autonomous manufacturing device forms the implant into a shape defined by at least one dimension of the computer-readable trace.

A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.

A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.

A laser pipe cutting device is provided. It includes a cutting head, a lathe bed, a first chuck, a second chuck and a third chuck; the first chuck is a fixed chuck for positioning axially and radially a pipe fitting; the second chuck is a rolling chuck for positioning radially the pipe fitting; and a fixed clamping disc and a rolling clamping disc are arranged on the third chuck at both ends. In the scheme, the third chuck integrates both the rolling clamping function and the fixed clamping function to achieve larger supporting weight and more accurate clamping precision, so that the chucks can drive a thin pipe fitting to rotate at a higher speed, the cutting efficiency is improved, and no-dead-angle and zero-tailing cutting is achieved.

A laser pipe cutting device is provided. It includes a cutting head, a lathe bed, a first chuck, a second chuck and a third chuck; the first chuck is a fixed chuck for positioning axially and radially a pipe fitting; the second chuck is a rolling chuck for positioning radially the pipe fitting; and a fixed clamping disc and a rolling clamping disc are arranged on the third chuck at both ends. In the scheme, the third chuck integrates both the rolling clamping function and the fixed clamping function to achieve larger supporting weight and more accurate clamping precision, so that the chucks can drive a thin pipe fitting to rotate at a higher speed, the cutting efficiency is improved, and no-dead-angle and zero-tailing cutting is achieved.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active material provided area A1 in which an electrode active material layer 24 is provided on a surface of the electrode core 22 and including a core exposed area A2 in which the electrode active material layer 24 is not provided and the electrode core 22 is exposed, and an active material provided area cutting step for cutting the active material provided area A1 by a pulse laser, and a core exposed area cutting step for cutting the core exposed area A2 by the pulse laser. Then, in the case where the pulse width (ns) of the pulse laser is represented by X and the lap rate (%) is represented by Y for the core exposed area cutting step, a condition represented by Y≥−3log X+106 is satisfied. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.