Provided is an oriented electrical steel sheet including a groove existing on the surface of the electrical steel sheet and a forsterite layer formed on a part or all of the surface of the electrical steel sheet, in which forsterite which is extended from the forsterite layer and penetrates to a base steel sheet in an anchor form is present on the surface of the side of the groove.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

A wafer processing method for processing a wafer formed on a front surface thereof with a plurality of devices having projection-shaped electrodes, the devices being partitioned by streets, includes a cutting step of holding a back surface of the wafer by a holding surface of a chuck table and cutting head portions of the projection-shaped electrodes by a cutting tool slewed in parallel to the holding surface, to make uniform the electrodes in height and expose metallic surfaces; a thermocompression bonding sheet laying step of laying a thermocompression bonding sheet on the front surface of the wafer; a thermocompression bonding step of heating and pressing the thermocompression bonding sheet to perform thermocompression bonding; and a peeling step of peeling off the thermocompression bonding sheet from the wafer, before dividing the wafer into individual device chips and bonding the electrodes to a circuit board.

A wafer processing method for processing a wafer formed on a front surface thereof with a plurality of devices having projection-shaped electrodes, the devices being partitioned by streets, includes a cutting step of holding a back surface of the wafer by a holding surface of a chuck table and cutting head portions of the projection-shaped electrodes by a cutting tool slewed in parallel to the holding surface, to make uniform the electrodes in height and expose metallic surfaces; a thermocompression bonding sheet laying step of laying a thermocompression bonding sheet on the front surface of the wafer; a thermocompression bonding step of heating and pressing the thermocompression bonding sheet to perform thermocompression bonding; and a peeling step of peeling off the thermocompression bonding sheet from the wafer, before dividing the wafer into individual device chips and bonding the electrodes to a circuit board.

A device for producing and removing an internal contour from a planar substrate comprising: a beam-producing- and beam-forming arrangement which is configured to perform: a contour definition step wherein a laser beam is guided over the substrate to produce a plurality of individual zones of internal damage in a substrate material along a contour line defining the internal contour; a crack deformation step, wherein the laser beam is guided over the substrate and produces a plurality of individual zones of internal damage in the substrate material to form a plurality of crack line portions that lead away from the contour line into the internal contour; and a material removal-step, wherein a laser beam directed towards the substrate surface that inscribes a removal line through a thickness of the substrate at the internal contour causes the internal contour to detach from the substrate.

A device for producing and removing an internal contour from a planar substrate comprising: a beam-producing- and beam-forming arrangement which is configured to perform: a contour definition step wherein a laser beam is guided over the substrate to produce a plurality of individual zones of internal damage in a substrate material along a contour line defining the internal contour; a crack deformation step, wherein the laser beam is guided over the substrate and produces a plurality of individual zones of internal damage in the substrate material to form a plurality of crack line portions that lead away from the contour line into the internal contour; and a material removal-step, wherein a laser beam directed towards the substrate surface that inscribes a removal line through a thickness of the substrate at the internal contour causes the internal contour to detach from the substrate.

A paper machine clothing has a plurality of through-channels formed in a usable region. The through-channels extend through the substrate to connect the upper and lower sides. The through-channels are non-cylindrical with a cross-sectional area becoming smaller along a thickness direction of the substrate from the upper side to a middle region of the substrate. An upper rim of at least one of the plurality of through-channels directly contacts an upper rim of at least one other neighboring through-channel of the plurality of through-channels, wherein the upper rims of both neighboring through-channels have at least three common local maxima, including two outer common local maxima and one intermediate common local maximum that is located between the two outer common local maxima. There is also described a method of producing such a paper machine clothing.

A paper machine clothing has a plurality of through-channels formed in a usable region. The through-channels extend through the substrate to connect the upper and lower sides. The through-channels are non-cylindrical with a cross-sectional area becoming smaller along a thickness direction of the substrate from the upper side to a middle region of the substrate. An upper rim of at least one of the plurality of through-channels directly contacts an upper rim of at least one other neighboring through-channel of the plurality of through-channels, wherein the upper rims of both neighboring through-channels have at least three common local maxima, including two outer common local maxima and one intermediate common local maximum that is located between the two outer common local maxima. There is also described a method of producing such a paper machine clothing.

A foreign substance capturing apparatus according to an embodiment of the present invention may comprise: a capturing body unit having an inlet port for introducing the air including magnetic foreign substances and an outlet port for discharging the air from which the magnetic foreign substances have been removed; and a magnetic isolation unit connected to the capturing body unit, including a magnetic member for isolating, by an attractive force, the magnetic foreign substances from the air flowing in the capturing body unit, and provided with a non-magnetic member surrounding the magnetic member.