A system includes a robotic arm, a rotisserie control linkage, and a computer system. The robotic arm includes a touch probe and laser head. The rotisserie control linkage is configured to couple to a transport cart. The computer system is communicatively coupled to the robotic arm and the rotisserie control linkage and is configured to control the system to probe, using the touch probe of the robotic arm, a transparent outer layer of an aircraft canopy located on the transport cart in order to determine surface measurements of the aircraft canopy. The computer system also controls the system to ablate, using a plurality of predetermined parameters and the laser head of the robotic arm, an interface layer located between the transparent outer layer and the aircraft canopy, wherein movements of the robotic arm during the ablation are based on the surface measurements.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

A peeling layer is formed in a workpiece in a state in which a laser beam is condensed so as to have a larger length along an indexing feed direction than a length along a processing feed direction. In this case, cracks included in the peeling layer extend along the indexing feed direction easily. It is consequently possible to increase a relative moving distance (index) between a place where the laser beam is condensed and the workpiece in an indexing feed step. As a result, it is possible to improve the throughput of a substrate manufacturing method using the laser beam.

A peeling layer is formed in a workpiece in a state in which a laser beam is condensed so as to have a larger length along an indexing feed direction than a length along a processing feed direction. In this case, cracks included in the peeling layer extend along the indexing feed direction easily. It is consequently possible to increase a relative moving distance (index) between a place where the laser beam is condensed and the workpiece in an indexing feed step. As a result, it is possible to improve the throughput of a substrate manufacturing method using the laser beam.

The present invention discloses a laser heating single-sensor fast scanning calorimeter, which comprises an FSC sample chamber, a chip sensor positioned in the FSC sample chamber and used for loading a sample, a laser heater for heating the sample, an infrared camera for shooting a sample image, a communication terminal and a control electronic element, wherein a perspective window serving as a light path channel is arranged in a center of the FSC sample chamber, and the laser heater and the infrared camera are positioned at the top of the perspective window; the infrared camera is connected with the communication terminal; one end of the control electronic element is connected with the communication terminal, and the other end of the control electronic element is connected with the laser heater and the chip sensor.

The present invention discloses a laser heating single-sensor fast scanning calorimeter, which comprises an FSC sample chamber, a chip sensor positioned in the FSC sample chamber and used for loading a sample, a laser heater for heating the sample, an infrared camera for shooting a sample image, a communication terminal and a control electronic element, wherein a perspective window serving as a light path channel is arranged in a center of the FSC sample chamber, and the laser heater and the infrared camera are positioned at the top of the perspective window; the infrared camera is connected with the communication terminal; one end of the control electronic element is connected with the communication terminal, and the other end of the control electronic element is connected with the laser heater and the chip sensor.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.

A laser blast shield for preventing damage to a first wall of a workpiece opposite a second wall being cut by a laser includes a metal substrate having a micro-textured topology and a highly reflective and thermally conductive metal coating deposited over the micro-textured surface to facilitate spreading of residual laser energy penetrating the second surface and absorption of the laser energy throughout the body of the blast shield.