A laser welding method is usable to weld a material containing copper as a main component. The laser welding method includes heating the material by irradiation with a first laser light and welding the material by irradiation of a portion, which has been irradiated with the first laser light, of the material with a second laser light with which an energy absorption rate of the copper contained in the material increases by an increase in a temperature of the material. A wavelength of the first laser light is 400 nm to 470 nm.

A laser pipe cutting device is provided. It includes a cutting head, a lathe bed, a first chuck, a second chuck and a third chuck; the first chuck is a fixed chuck for positioning axially and radially a pipe fitting; the second chuck is a rolling chuck for positioning radially the pipe fitting; and a fixed clamping disc and a rolling clamping disc are arranged on the third chuck at both ends. In the scheme, the third chuck integrates both the rolling clamping function and the fixed clamping function to achieve larger supporting weight and more accurate clamping precision, so that the chucks can drive a thin pipe fitting to rotate at a higher speed, the cutting efficiency is improved, and no-dead-angle and zero-tailing cutting is achieved.

A method of manufacturing an optionally shaped chip from a substrate having a crystalline structure includes establishing a projected dicing line on the substrate representing a contour of a chip to be fabricated from the substrate, and establishing a straight division assisting line contacting the contour of the chip for assisting in dividing the substrate. A division initiating point is formed after the projected dicing line is established and a laser beam is applied along the contour of the chip and the division assisting line while positioning a focused spot of the laser beam in the substrate at a predetermined position spaced from an upper surface of the substrate, thereby forming division initiating points in the substrate. The substrate is divided by applying external forces to the substrate in which the division initiating points have been formed, to divide the substrate along the division initiating points.

The present invention relates to a pre-stressed steel sheet and a method a method of manufacturing the same.

An embodiment of the present invention provides a pre-stressed steel sheet comprising: a base material; and a plurality of weld lines formed on the base materials, wherein the average spacing between each pair of the weld lines is equal to or greater than five times the width of the weld lines and equal to or less than half the width of the steel sheet.

According to an aspect of the present invention, a pre-stressed steel sheet having improved bendability can be provided, and accordingly when the pre-stressed steel sheet is applied to a structural member such as a girder or beam, the bendability of a structure can be improved.

A substrate dividing method includes preparing a substrate that is formed with division start points along streets and that has a protective sheet attached to a surface on one side thereof and rolling a roller on a surface on the other side of the substrate, to attach an expanding tape. Next, suction by a holding table is cancelled, and, in a state in which a slight gap is formed between a holding surface of the holding table and the protective sheet, the roller is brought into contact with the expanding tape and rolled, thereby extending cracks extending from the division start points while causing the substrate to sink into the gap through the protective sheet with the division start points as starting points, and the expanding tape is expanded to widen the chip intervals with the division start points as starting points.

Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +/−5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +/−5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

The present invention relates to a method for butt welding at least two metal sheets, namely a first metal sheet and a second metal sheet, wherein, in particular, a tailored blank is produced from the metal sheets.

The invention relates to a method for the media-tight connection of two plate-shaped components (1, 2), in particular two monopolar plates for the production of a bipolar plate, comprising the steps of: placing the first component (1) on a surface of a clamping device, placing the second component (2) on the first component (1), closing the clamping device, setting a first weld seam (3) on the second component (2), wherein a welding depth (t) is selected that is less than a material thickness (s) of the second component (2), with the result that a bend (5) is formed along the first weld seam (3) owing to the welding distortion, via which bend the second component (2) comes into linear contact with the first component (1), setting a connecting weld seam (4) on the first weld seam (3), with the result that the two components (1, 2) are welded to one another along the bend (5).