A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

A laser cleaning system includes a laser cleaning device having a laser rubber-removal assembly having a laser generator, a laser ejector connected with the laser generator, and a position adjustor slidably connected with a loading assembly; and a recycling assembly having a vacuum collector communicated with a recycling processing device; wherein the laser ejector is arranged on the loading assembly through the position adjustor; wherein the laser generator is configured to generate laser beams to remove rubber residues and the position adjustor is configured to adjust locations of the laser ejector; wherein the vacuum collector is configured to collect the rubber residues and the recycling processing device is configured to granulate the collected rubber residues.

Embodiments described herein are generally directed to a venturi valve. The venture valve includes an inlet; an outlet opposite of the inlet; a passage, a primary orifice, and an insert. The passage is positioned between the inlet and the outlet and fluidly coupling the inlet to the outlet. The primary orifice is positioned between the inlet and the outlet and in fluid communication with the passage such that the primary orifice permits fluid to enter the passage. The insert is positioned between the inlet and the outlet, the insert configured to enclose at least a portion of the passage.

The invention relates to a material feeding device. The material feeding device according to the invention to be used in a material processing device has a material feeding channel with an output end facing a processing site during operation of the material feeding device, and is characterized in that the material feeding device has at least one microchannel.

A laser processing head for a laser beam uses actuators engaged with a delivery fiber end to deflect the fiber end relative to an optical axis. The laser beam from the fiber end is collimated by a collimator and is then focused by a focusing component disposed in the head beyond the collimator to a focal point. The focal point of the laser beam is deflected from the optical axis in relation to the deflection of the fiber end. The fiber end and the actuators are housed in a sealed module. Deflection of the laser beam can be sensed by reflecting portion of the laser beam to a sensing element so a control system can monitor and control the fiber end's movement. A mode-stripper in the sealed module removes light from cladding of the delivery fiber, and an actively cooled absorber in the module around the fiber absorbs the energy.

An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control the rate of cooling experienced by each successive additive layer. Accordingly, the system may be used to heat treat the various additive layers.

A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.

A manipulator device such as a robot arm that is capable of increasing manufacturing throughput for additively manufactured parts, and allows for the manipulation of parts that would be difficult or impossible for a human to move is described. The manipulator can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.

In a cryogenic workbench, a cryogenic laser peening system and a control method, a tapered surface gap d is adjusted, based on the electromagnetic principle, to control the gasification volume of liquid nitrogen, then the temperatures of the copious cooling workbench and the surface of a sample are precisely controlled by means of the adjustment of the heat absorption amount of liquid nitrogen gasification, the temperature adjustment range and the temperature rising/lowering rate of the cryogenic laser peening system are effectively extended, and the precision of the control of the surface temperature of the sample is increased in combination with a closed-loop control. Additionally, an intelligent control of a cryogenic laser peening process is realized by means of a computer and a PLC control unit, whereby the usage amount of liquid nitrogen in the experiment process is reduced and the processing efficiency is improved.

A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.