An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.

A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.

A gas powered tool (70) comprising a housing (73) and a soldering tool element (72) releasably coupled to the housing (73). A latching element (105) pivotally mounted on a pivot pin (106) in the housing (73) is retained in a non-latching state (FIG. 26) by an abutment element (102) which is urgeable into the housing (73) by the soldering tool element (72) when the soldering tool element (72) is coupled to the housing (73). The latching element (105) is spring biased in the direction of the arrow E from the non-latching state to a latching state (FIG. 27) for latching a switching element (89) in a first state to in turn retain an isolating valve (86), which supplies fuel gas from a reservoir (78) in the housing (73) to the soldering tool element (72), in the isolating state. On decoupling of the soldering tool element (72) from the housing (73), the abutment element (102) is spring urged outwardly and disengages the latching element (105). The latching element (105) pivots about the pivot pin from the non-latching state to the latching state engaging the switching element (89) in the first state, thereby retaining the isolating valve (86) in the isolating state isolating the soldering tool element (72) from the fuel gas in the fuel gas reservoir (78) in the housing (73).

An iron tip cleaner device includes a cleaner portion that strips off a solder residue adhered to an iron tip of a soldering iron through jetting of air; an air supply portion supplying, to the cleaner portion, the air to be jetted; and an air exhaust portion exhausting the air jetted to the soldering iron. The air exhaust portion includes a first opening that is an opening through which the air jetted to the soldering iron is discharged and a second opening that is an opening of a pipe starting from an air supply port, a flow of air jetted from the second opening promotes the discharge of the air from the first opening, and air supplied to the air supply portion which supplies, to the cleaner portion, the air to be jetted and the air jetted from the second opening are supplied from one common air supply port.

The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.