A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.

A soldering station or a soldering station system including a soldering station and a soldering iron includes a control console and an iron holder operably coupled to the control console for supporting a soldering iron. The iron holder comprises a handle support portion and a base portion operably coupling the handle support portion to the control console. The handle support portion is oriented with respect to the base portion to define an axis. The axis forms an angle of between about 10 degrees to about 40 degrees relative to a horizontal surface supporting the soldering station. The handle support portion is shaped to receive the soldering iron in a tip-up orientation. The soldering iron may include a handle, a transition portion, a shaft portion, a tip, and a longitudinal centerline.

An iron holder includes a stand body, a rest, and a heat shield configured to at least partially surround a soldering iron. The stand body includes a tip support portion, a base portion, an intermediate portion, an accessory holding portion, and a handle support portion. The tip support portion is higher in elevation than the handle support portion, creating a tip-up angle for the soldering iron to rest at. The heat shield is disposed at the tip support portion and comprises one singular piece of metal that is bent into a half-pipe shape and perforated with holes. The handle support portion has a rubberized cover for additional grip and heat insulation. The rest ensures that a tip of the soldering iron does not contact the heat shield. In the tip-up orientation, the soldering iron handle is less likely to increase in temperature from the tip of the soldering iron.

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.

A soldering tool includes a housing having a handle portion defining a first longitudinal axis, and a head portion coupled to the handle portion and defining a second axis. The soldering tool further includes a heating element coupled to the head portion for movement therewith. The head portion is movable relative to the handle portion between a first orientation in which the second axis is coaxial with the first axis, and a second orientation in which the second axis is non-coaxial with the first axis.

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.

The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.

A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500 F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.

A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.