The invention discloses a smart desoldering device and method for laser removal of substrate solder mask driven by artificial intelligence. The smart desoldering device includes an artificial intelligence (AI) system including a database unit, a learning and training unit, a parameter optimization setting unit, a condition restriction unit and an AI model processing unit, a control processing module, a camera module and a laser desoldering module. The artificial intelligence (AI) system is used to learn and pre-train the types, sizes and thicknesses of substrates, the colors and thickness of solder mask and the depth around solder pads, and automatically optimize and set all processing parameters according to the characteristics of the substrate to be processed. The artificial intelligence (AI) system controls the laser desoldering module to perform laser desoldering on the substrate according to the first control command and a circuit layout diagram.

A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

The present disclosure provides an electric iron (1) and a soldering device. By providing a first gas conveying device (15, 18) on a housing (11) of the electric iron (1) and providing a second gas conveying device (16, 19) connected to the first gas conveying device (15, 18) on a handle (12), it is possible to utilize negative pressure within the first gas conveying device (15, 18) and the second gas conveying device (16, 19) to suck in the smog produced during soldering at an end of the first gas conveying device (15, 18) far away from the second gas conveying device (16, 19), and to discharge the smog from the second gas conveying device (16, 19).

Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.

Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.

A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.