Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.

A brazing connection includes a first component comprising a first material and including a first connection portion, a second component comprising a second material and including a second connection portion, a heating element that is electrically conductive and electrically resistant positioned between the first connection portion of the first component and the second connection portion of the second component, where the heating element is configured to transmit heat when conducting an electrical current, and a brazing material configured to melt when receiving heat from the heating element, thereby connecting the first component to the second component.

A brazing connection includes a first component comprising a first material and including a first connection portion, a second component comprising a second material and including a second connection portion, a heating element that is electrically conductive and electrically resistant positioned between the first connection portion of the first component and the second connection portion of the second component, where the heating element is configured to transmit heat when conducting an electrical current, and a brazing material configured to melt when receiving heat from the heating element, thereby connecting the first component to the second component.

A gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet of the gas nozzle having a gas distributor/diffuser section has a double-walled configuration at least in a partial area of the gas distributor/diffuser section in order to create a flow space for the protective/shielding gas stream. The invention also relates to a torch neck and to a method for thermally joining at least one workpiece, in particular for arc joining, preferably for arc welding or arc brazing/soldering, with an electrode which is arranged in the torch neck or with a wire for producing an arc between the electrode or the wire and the workpiece, and having a gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet.

A gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet of the gas nozzle having a gas distributor/diffuser section has a double-walled configuration at least in a partial area of the gas distributor/diffuser section in order to create a flow space for the protective/shielding gas stream. The invention also relates to a torch neck and to a method for thermally joining at least one workpiece, in particular for arc joining, preferably for arc welding or arc brazing/soldering, with an electrode which is arranged in the torch neck or with a wire for producing an arc between the electrode or the wire and the workpiece, and having a gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet.

Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.

The present disclosure relates to a method for producing a final metal part for a nacelle of a turbojet. The method includes brazing at least two parts, one being an inner part having an inner surface and the other being an outer part having an outer surface. The method further includes a step of heating the outer surface of the outer part using an external heating means, and a step of heating the inner surface of the inner part using an internal heating means.

The present disclosure relates to a method for producing a final metal part for a nacelle of a turbojet. The method includes brazing at least two parts, one being an inner part having an inner surface and the other being an outer part having an outer surface. The method further includes a step of heating the outer surface of the outer part using an external heating means, and a step of heating the inner surface of the inner part using an internal heating means.

In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.