Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

The present invention provides a brazing material application method that can stably discharge a brazing material containing a fluoride-based flux over a long period of time. The brazing material application method of the present invention includes: a supply step of supplying a liquid brazing material containing a fluoride-based flux to a liquid chamber of a discharge apparatus that is configured to have the liquid chamber having a discharge channel, a plunger disposed in the liquid chamber movably forward and backward, and a drive device for moving the plunger forward and backward and to satisfy a predetermined relationship; and an application step of discharging the brazing material in the liquid chamber from the discharge channel by moving the plunger toward the discharge channel of the liquid chamber by the drive device, and applying the brazing material to a metal member.

In wire processing systems and methods, a wire channel receives a wire. One or more fluid guides flow the fluid into the wire channel to move, along the wire, a component (e.g. a solder sleeve) positioned at least partially in the wire channel and coupled to the wire. Other features are also provided.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.

A solder cutting device includes a first holding part, a first drive part that feeds a tape-like solder material held by the first holding part in a first direction, a cutting part for cutting the tape-like solder material, and a second drive part that actuates the cutting part. The first drive part is a first actuator that is electrically-driven and that converts a rotational motion of a rotating body, the axis of which extends in the first direction, into a motion in the first direction. The second drive part includes a second actuator that moves a moving body in the first direction, and a connection portion that converts the motion of the moving body into a motion in a second direction and transmits the motion to the cutting part.

A solder cutting device includes a first holding part, a first drive part that feeds a tape-like solder material held by the first holding part in a first direction, a cutting part for cutting the tape-like solder material, and a second drive part that actuates the cutting part. The first drive part is a first actuator that is electrically-driven and that converts a rotational motion of a rotating body, the axis of which extends in the first direction, into a motion in the first direction. The second drive part includes a second actuator that moves a moving body in the first direction, and a connection portion that converts the motion of the moving body into a motion in a second direction and transmits the motion to the cutting part.

A solder supply unit includes a base member, a reel holder that is provided on the base member and rotatably holds a reel of a tape-like solder material, a support member provided on the base member, and a guidance member that is provided on the support member and that guides at least a lower surface of the tape-like solder material wound around the reel when the tape-like solder material is fed out.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.