A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.

A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.

A jet soldering apparatus includes a first housing; a first supply port provided on the first housing and configured to provide first molten solder; a second housing; and a second supply port provided on the second housing and configured to provide second molten solder. The jet soldering apparatus is configured to mix the first molten solder and the second molten solder so as to obtain mixed molten solder. The jet soldering apparatus is configured to provide the mixed molten solder such that the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.

A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.

According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

A soldering tip for a soldering apparatus and a method of forming a soldering tip for a soldering apparatus, the tip comprising: a body formed of a first material; a proximal end for attaching the tip to the selective soldering apparatus; and a distal end, the distal end having an outer surface, at least a region of which is formed from a second material, different to the first, the second material exhibiting greater solder wettability characteristics than the first material. The first material is preferably titanium or a titanium alloy and the region is preferably formed on the first material by first using a physical vapour deposition (PVD) process to create a first coating on at least a first part of the first material, which first part underlies the region, and then coating at least a part of that first coating with the second material.

A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.

A selective soldering machine configured to adjust a solder wave provided by a selective soldering nozzle based on at least one property detected by an image sensor of the selective soldering machine. The selective soldering nozzle may be configured to provide a solder wave to solder a portion of a workpiece. The image sensor may be configured to detect at least one property of the selective soldering nozzle and/or the solder wave in real-time. The selective soldering machine may include a controller that is configured to adjust the solder wave provided by the selective soldering nozzle based on the at least one property detected by the image sensor.

A soldering system includes a first solder wave height sensor to generate a first sensor signal and a second solder wave height sensor to generate a second sensor signal. The system further includes control circuitry to control an operation of the soldering system based on the first sensor signal and the second sensor signal.

A wave soldering station of a wave soldering machine includes a flow duct positioned in a reservoir of a solder pot, and a core frame supported by the flow duct. The wave soldering station further includes a first pump to deliver solder material to a first chamber, a second pump to deliver solder material to a second chamber, and a wave soldering nozzle assembly supported by the core frame. The wave soldering nozzle assembly includes a solder distribution baffle to create a solder wave, and an exit wing coupled to the core frame and configured to move from a lowered position to enable increased solder flow and a raised position to decrease flow of solder material. The first pump, the second pump and the exit wing are configured to control the flow of solder through the solder distribution baffle to vary a contact length of the solder wave.