An electric component manufacturing device includes a preheater that contacts and preheats a transported work, a melting heater that is downstream of the preheater in a transport direction of the work and contacts and heats the work at a temperature which is higher than a temperature of the preheater and at which a solder melts, a cooler that is downstream of the melting heater in the transport direction and contacts and cools the work, and a transporter that supports and transports the work to sequentially contact the preheater, the melting heater, and the cooler in this order. The transporter performs intermittent transport in which the work is transported from the preheater to the melting heater without stopping to contact both the preheater and the melting heater at the same time, and then the work stops on the melting heater.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

There is provided a spray apparatus. A first nozzle is configured to eject mist. A second nozzle is provided around the first nozzle. The second nozzle is configured to suck a part of the mist ejected from the first nozzle and to eject a remnant of the mist to an ejection target.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A flux reservoir apparatus (100, 200) includes a stage (12) having a recessed portion (13) for reserving flux (51, 52, 53) therein and a flux pot (20) composed of an annular member having a through hole (30) through which the flux (51, 52, 53) flows, the flux pot arranged to move back and forth on the surface (14) of the stage (12) to feed the flux (51, 52, 53) into the recessed portion (13) and to smooth the surface of the flux (51, 52, 53), in which the through hole (30) is an elongated hexagonal hole with a length greater than the width of the recessed portion (13) in the direction perpendicular to the back-and-forth direction, and in which the bottom surface of a flux pot main body (21) is a chevron surface. This reduces leakage of the flux (51, 52, 53) in the flux reservoir apparatus (100, 200).

An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

The present application relates to a stencil device (150) for simultaneous stencil printing of brazing material onto elevations, areas surrounding port openings, and a circumferential skirt (210) of a heat exchanger plate (200) wherein the stencil device (150) comprises an upper stencil having openings for applying brazing material to elevations and areas surrounding port openings of the heat exchanger plate (200) and a lower stencil printing stencil (150) having a large opening (190) for receiving the heat exchanger plate (200) and contacting an outer perimeter of the circumferential skirt (210) of the heat exchanger plate (200), wherein an inner surface (195) of the large opening (190) comprises brazing material exits (160) for applying brazing material to the circumferential skirts (195). Disclosed is also a method of such stencil printing and also the use of a stencil device for applying heat exchanger plates (200) with a brazing material.

Provided is a condensation device capable of removing water vapor from a larger amount of gas without making a size larger than in related art. A condensation device 700 according to the present invention includes an outer cooling unit 720 including one or two or more inner tubes 722, an outer tube 724 located outside the one or two or more inner tubes 722, and a first flow path 726 through which a first cooling medium passes between the one or two or more inner tubes 722 and the outer tube 724.

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

In an application method of a solid brazing material, while being rotated, the solid brazing material is brought into contact with an aluminum plate material, thereby applying the solid brazing material to the aluminum plate material.