A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A flux dotting tool is provided that includes: a housing having an internal space and a plurality of through-holes extending from the internal space to an outside of the housing; a plurality of flux pins disposed in the internal space to correspond to the plurality of through-holes, respectively, wherein each of the plurality of flux pins includes a flux holding portion extending in a first direction and that is exposed to the outside of the housing, and a flux blocking structure protruding in a second direction, perpendicular to the first direction, from a side surface of the flux holding portion, and the flux blocking structure is configured to limit a flux wetting region; and an elastic structure disposed on the plurality of flux pins in the internal space and configured to impart elastic force in the first direction.

A fluid supply apparatus includes a container supply holder configured to supply a container to a cap separator using a loading box, the container including a detachable nozzle cap, and configured to store a process fluid, a cap separator configured to receive the container from the loading box and separate the nozzle cap from a container body of the container using a cap clamper and a rotation actuator, the cap clamper configured to clamp and hold the nozzle cap, and the rotation actuator configured to rotate the container body, a fluid supplier configured to supply the process fluid contained in the container body through a fluid supply line, and a controller configured to control the container supply holder, the cap separator, and the fluid supplier.

A first-in first-out solder container automatic supply management system includes a refrigerating chamber configured to store a plurality of solder containers, a transfer part positioned outside the refrigerating chamber and configured to move at least one of the plurality of solder containers, a stirring part formed at one end of the transfer part and configured to stir the at least one solder container, and a hand part configured to move any one solder container of the at least one solder container positioned on the transfer part to the stirring part.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.

A flux tool allows the elastic pad to pressurize each flux pin individually in a process of dotting flux, so that even though a wafer or die may be deformed, high-quality flux dotting is achieved. Specifically, the flux tool allows the elastic pad pressurizing the flux pins to be made of rubber, especially silicone, so that primarily, the flux pins are entirely pressurized uniformly by means of the elastic force of the elastic pad, and secondarily, each flux pin is individually pressurized against the underside of the elastic pad, thereby adjusting the heights of the flux pins upon flux dotting according to the flatness or bent shape of the wafer or die to minimize the flux dotting defects.

A dipping apparatus includes a squeegee device and a plate for forming a flux film out of flux. A surface of the plate has a rough surface with a nano-level arithmetically average roughness. The dipping apparatus is configured in such a way that the squeegee device and the plate are moved relatively to each other, and the flux is fed from the squeegee device to the rough surface of the plate.

A fluid supply apparatus includes a container supply holder configured to supply a container to a cap separator using a loading box, the container including a detachable nozzle cap, and configured to store a process fluid, a cap separator configured to receive the container from the loading box and separate the nozzle cap from a container body of the container using a cap clamper and a rotation actuator, the cap clamper configured to clamp and hold the nozzle cap, and the rotation actuator configured to rotate the container body, a fluid supplier configured to supply the process fluid contained in the container body through a fluid supply line, and a controller configured to control the container supply holder, the cap separator, and the fluid supplier.