Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H.sub.1, and a height of the solder particle is designated as H.sub.2, H.sub.1<H.sub.2 is established.

A connector-soldering aid (1) for soldering single and/or cable wires to a connector comprises a connector mount (5) with a first stand (9) and a cable mount (7) with a second stand (31). The connector mount (5) has a base body (17), which is arranged on the first stand (9) and is rotatable relative to the latter about a fixed axis of rotation (19). The connector mount (5) further comprises a replaceable attachment (21) with a connector receiver and a centring device (23) for centring the attachment (21). The centring device (23) is arranged on the base body (17) and is further formed to centre the attachment (21) such that the connector receiver is positioned centrally in relation to the axis of rotation (19) of the base body (17).

In wire processing systems and methods, a wire channel receives a wire. One or more fluid guides flow the fluid into the wire channel to move, along the wire, a component (e.g. a solder sleeve) positioned at least partially in the wire channel and coupled to the wire. Other features are also provided.

A brazing method for brazing a material without using a flux includes performing brazing in an inert gas atmosphere, in a state in which the material to be brazed is covered with a cover member formed of an upper cover portion covering the whole upper portion of the material to be brazed and side cover portions covering at least some of the side portions of the material to be brazed, with the upper cover portion contacting the upper portion of the material to be brazed, and the material to be brazed and the cover member are held with a heat transmission promoting member formed of an upper heat transmission promoting portion and a lower heat transmission promoting portion, with the upper heat transmission promoting portion contacting the upper cover portion, and with the lower heat transmission promoting portion contacting the lower portion of the material to be brazed.

There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

An apparatus for manufacturing a heat exchanger for a vehicle has a plurality of cooling panels bonded to each other by pressing a cooling panel module where the plurality of cooling panels are stacked vertically, including: a fixing portion for supporting top and bottom ends of the cooling panel module; and a pair of elastic portions that are provided between the top or bottom end of the cooling panel module and the fixing portion, and are arranged symmetrically based on a top or bottom surface of the cooling panel module to compress the cooling panel module.

A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.

An apparatus for fabricating an internally finned pressure vessel includes a plurality of positioning discs, each of the positioning discs defining a plurality of circumferentially spaced slots extending radially into the positioning disc from a perimeter thereof, and one or more rods extending through the plurality of positioning discs, the plurality of positioning discs being held in axial alignment by the one or more rods. A method of fabricating the internally finned pressure vessel includes providing the apparatus, loading a plurality of fins into the slots of the positioning discs, inserting the apparatus containing the plurality of fins into a pressure vessel, attaching the plurality of fins to the pressure vessel by a brazing process, and removing the apparatus from the pressure vessel.