Patent classifications
B23K35/005
Interlayered structures for joining dissimilar materials and methods for joining dissimilar metals
An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.
MULTI-METALLIC ARTICLES OF MANUFACTURE
Methods disclosed herein include using additive manufacturing to create a joint between a first metallic material and a second metallic material that is different from the first metallic material, wherein the porosity of the joint is less than about 0.1 percent by volume measured according to ASTM B-962. The additive manufacturing can be performed such that no intermetallic brittle phase forms between the first metallic material and the second metallic material.
Semiconductor Substrate Support With Multiple Electrodes And Method For Making Same
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770C to 1200C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.
Method for manufacture of a multi-layer plate device
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Cladded article with clad layer having varying thickness
A cladded article may include a first metallic layer, a clad layer, and a first solid-state welding interface region positioned between the clad layer and the first metallic layer. The clad layer may include a first clad layer region having a first clad layer thickness in a thickness direction of the clad layer and a second clad layer region having a second clad layer thickness in the thickness direction of the clad layer. The second clad layer thickness may be greater than the first clad layer thickness.
Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Interlayered Structures for Joining Dissimilar Materials and Methods for Joining Dissimilar Metals
An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.
Clad article and method for forming clad article
A clad article is disclosed including an article and a cladding layer. The article includes a surface layer, at least one cavity disposed within the article below the surface layer, and at least one microcrack disposed in the surface layer. The surface layer includes an HTW alloy. The cladding layer is disposed on a surface of the surface layer, and is formed from a PSP brazed to the article. The cladding layer is disposed over the at least one microcrack. A method for forming the clad article is disclosed including disposing the PSP on the article and brazing the PSP to the article. Brazing the PSP to the article forms the cladding layer disposed on the article over the at least one microcrack.
COMPOSITE MATERIAL
A composite material includes: a first member containing tungsten as a primary component; a second member containing copper as a primary component, the second member being joined to the first member; and a metal containing at least one metal selected from a group consisting of titanium, zirconium, and hafnium, the metal being present in the second member, wherein a concentration of the metal is more than 0 atomic % and less than or equal to 5.0 atomic % at a location of 5 ?m from a joining interface between the first member and the second member toward the second member side.