Described herein is an aluminium alloy multi-layered brazing sheet product for brazing in an inert-gas atmosphere without a flux, comprising a core layer made of a 3xxx alloy comprising 0.20-0.75 wt. % Mg, and provided with a covering clad layer comprising 2-5 wt. % Si on one or both sides of said 3xxx alloy core layer and a Al—Si brazing clad layer comprising 7-13 wt. % Si positioned between the 3xxx alloy core layer and the covering clad layer, wherein the covering clad layer has a thickness X.sub.1 and the Al—Si brazing clad layer has a thickness X.sub.2 and wherein X.sub.2≥2X.sub.1. The invention further relates to the use of an aluminium alloy multi-layered brazing sheet product in a fluxfree controlled atmosphere brazing (CAB) operation to produce a heat exchanger apparatus.

A butt joint deep penetration laser welding method is used for joining facing end sections of flat steel products, each having a carbon content CS<0.02%. In order to improve such a method such that an improved weld quality in terms of geometry and strength is achievable with it, at least one carbon-containing carrier material is inserted into a butt joint gap between the end sections, the carbon content of which is C.sub.T≥20.Math.C.sub.S, preferably C.sub.T≥100.Math.C.sub.S, and/or carbon is inserted into the butt joint gap or applied to at least one end section, such that the volume of the carbon inserted into the butt joint gap corresponds to 1% to 20% of the volume of a melt produced by a butt joint deep penetration laser welding process.

The present invention relates to paste compositions comprising an indium metal powder; and an organic vehicle. The organic vehicle includes one or more C8-C18 fatty acids; a salt formed from a C4-C6 carboxylic acid and a tertiary alkanolamine; a cationic catalyst; a thixotrope; and a diluent.

Some implementations of the disclosure are directed to a thermal interface material. In some implementations, a method comprises: applying a solder paste between a surface of a heat generating device and a surface of a heat transferring device to form an assembly; and reflow soldering the assembly to form a solder composite, wherein the solder composite provides a thermal interface between the heat generating device and the heat transferring device, wherein the solder paste comprises: a solder powder; particles having a higher melting temperature than a soldering temperature of the solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature particles between 5:1 and 1:1.5; and flux.

Disclosed herein is an electroslag welding wire containing, by mass % based on total mass of the wire: C: more than 0% and 0.07% or less; Si: more than 0% and 0.50% or less; Mn: more than 0% and 1.0% or less; Ni: 6.0 to 15.0%; and Fe: 79% or more. The electroslag welding wire satisfies the following relationship (1): 0.150≤C+Si/30+Mn/20+Ni/60≤0.300 (1).

A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.

A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

Systems and methods for low-manganese welding alloys are disclosed. An example arc welding consumable may comprise: less than 0.4 wt % manganese; strengthening agents selected from the group consisting of nickel, cobalt, copper, carbon, molybdenum, chromium, vanadium, silicon, and boron; and grain control agents selected from the group consisting of niobium, tantalum, titanium, zirconium, and boron. The grain control agents may comprise greater than 0.06 wt % and less than 0.6 wt % of the welding consumable. The resulting weld deposit may comprise a tensile strength greater than or equal to 70 ksi, a yield strength greater than or equal to 58 ksi, a ductility (as measured by percent elongation) of at least 22%, and a Charpy V-notch toughness greater than or equal to 20 ft-lbs at −20° F. The welding consumable may provide a manganese fume generation rate less than 0.01 grams per minute during the arc welding operation.