Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

Provided herein is a stop-off material for a brazing process. The stop-off material includes a solvent, a thickener, and magnesium oxide. About 5 weight percent to about 60 weight percent of the stop-off material comprises the magnesium oxide. The stop-off material is configured to be removed from a surface after heating and via air pressure.

A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

A method of producing a micromachined workpiece by laser micromachining includes applying a protective layer (SS) to a surface (OF) of the workpiece (WS) and machining the surface in a machining area by a laser beam (LS) through the protective layer, wherein the protective layer (SS) is produced using a coating fluid (SF) containing an at least partially volatile carrier liquid (TF) in which metallic and/or ceramic particles (PT) are dispersed; the coating fluid (SF) is applied to the surface (OF) such that at least the machining area (MA) is covered with a protective coating fluid layer (SSF); the applied coating is dried to reduce the content of carrier liquid (TF) such that a protective layer (SS) forms, which is essentially composed of the particles (PT) of the applied coating fluid or of these particles and a reduced content of the carrier liquid relative to the coating fluid; and machining of the machining areas is carried out by a laser beam (LS) irradiated through the protective layer onto the workpiece (WS).