The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

A composition for producing aluminum casting, wrought, and welding filler metal alloys having a chemistry comprising Si varying from approximately 0.1 and 0.9 wt %, Mn varying from approximately 0.05 to 1.2 wt %, Mg varying from approximately 2.0 to 7.0 wt %, Cr varying from approximately 0.05 to 0.30 wt %, Zr varying from approximately 0.05 to 0.30 wt %, Ti varying from approximately 0.003 to 0.20 wt %, and B varying from approximately 0.0010 to 0.030 wt %, and a remainder of aluminum and various trace elements. The alloy is particularly suited to producing high strength structures such as automobiles, truck trailers, rail cars, and ships. It is the first 6xxx series weld filler metal that can be post-weld thermally treated and can weld 3xxx, 5xxx, 6xxx, and 7xxx series base alloys yielding far superior mechanical properties than those attainable from any other aluminum filler metal.

The present invention relates to a composition based on yttrium oxide, on a cerium-based compound and on an organic compound and its use in the field of welding as stop-off product. The composition comprises, in an aqueous medium: yttrium oxide particles; particles of a cerium-based compound: which is cerium oxide; or which is prepared by the process consisting in causing a colloidal dispersion D, which is obtained by the neutralization of an aqueous cerium nitrate solution by a basic aqueous solution, to undergo heating; an organic compound chosen from the group formed by polyvinylpyrrolidone, polyvinyl alcohol, carboxymethyl cellulose and hydroxyethyl cellulose.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

This invention relates to the field of welding high strength aluminum structures, and more particularly to the alloy filler metal composition, its resultant microstructure, and the physical and mechanical properties which are obtained in the weld bead during fusion welding. A composition for producing small diameter aluminum welding filler metal wires having a chemistry comprising Si varying from approximately 0.3 to 0.9 wt. %, Mn varying from approximately 0.05 to 1.2 wt. %, Mg varying from approximately 2.0 to 7.0 wt. %, Cr varying from approximately 0.05 to 0.30 wt. %, Zr varying from approximately 0.05 to 0.30 wt. %, Ti varying from approximately 0.003 to 0.20 wt. %, and B varying from approximately 0.0010 to 0.030 wt. %, and a remainder of aluminum and various trace elements.

Disclosed herein are solder mask formulations that include a liquid photo imagable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.