A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.

An airfoil includes a first airfoil piece and a second airfoil piece that is bonded to the first airfoil piece at a joint. The first airfoil piece and the second airfoil piece are formed of aluminum alloys. At least one of the aluminum alloys is an aluminum alloy composition that has greater than 0.8% by weight of zinc. The joint includes a braze element of magnesium, zinc, or combinations thereof in a higher concentration than in other portions of the first airfoil piece and the second airfoil piece.

A method of soldering includes providing a substrate having a first metal joining surface, providing a semiconductor die having a second metal joining surface, providing a solder preform having a first interface surface and a second interface surface, arranging the solder preform between the substrate and the semiconductor die such that the first interface surface faces the first metal joining surface and such that the second interface surface faces the second metal joining surface, and performing a mechanical pressure-free diffusion soldering process that forms a soldered joint between the substrate and the semiconductor die by melting the solder preform and forming intermetallic phases in the solder. One or both of the first interface surface and the second interface surface has a varying surface profile that creates voids between the solder preform and one or both of the substrate and the semiconductor die before the melting of the solder preform.

Methods for joining a first blank and a second blank, at least one of the first and second blanks comprising at least a layer of aluminum or of an aluminum alloy or a layer of zinc or of a zinc alloy. The method comprises selecting a first portion of the first blank to be joined to the second blank, and selecting a second portion of the second blank to be joined to the first portion, and welding the first portion to the second portion. The welding comprises using a filler metal laser beam and a welding laser beam, and displacing both laser beams in a welding direction to melt and mix a filler wire material with the melted portions of the two blanks. The present disclosure further relates to blanks obtained by any of these methods and to products obtained from such blanks.

A method for providing a welded joint includes: providing a first metal sheet having a first melting point; providing a second metal sheet having a second melting point, the second melting point being lower than the first melting point; providing a weld material; and joining the first metal sheet and the second metal sheet together by means of the weld material, thus defining a first joining interface between the first metal sheet and the weld material and a second joining interface between the second metal sheet and the weld material. The joining includes heating the second metal sheet at the second joining interface to a temperature higher than the second melting point, but lower than the first melting point.

A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

A method produces at least one defined connecting layer between two components, wherein the first component is produced from a first metallic material and the second component is produced from a second metallic material and the first and/or second component has a coating of a third metallic material, the melting temperature of which is lower than the melting temperature of the first and second materials. In this case, the coating of at least one of the components is heated locally to a connecting temperature, which lies above the melting temperature of the third material and lies below the melting temperature of the first material and below the melting temperature of the second material, and is cooled down in order to form a defined connecting layer when the coating solidifies.

An electrode wire for use in an electrical discharge machining apparatus includes a metallic core and a layer of gamma phase brass disposed over the metallic core. Particles of beta phase brass are interspersed within the gamma phase brass layer. An oxide layer including zinc is disposed over the gamma phase brass layer.

A filler wire may include a rod including an aluminum-silicon (Al—Si) alloy powder and a fluoride flux powder, and a sheath including zinc (Zn) alloy and surrounding the rod.

A chip arrangement including: a chip including a chip back side; a substrate including a surface with a plating; and a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy including, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.