Low melting temperature flux materials for brazing applications and methods of brazing using the same are provided. A low melting temperature flux material for brazing applications includes as a majority constituent, a Cs-containing flux material, as a first minority constituent, a eutectic blend composition, and, optionally, as a second minority constituent, a mediating compound. The second minority constituent is present in the low melting temperature flux material in a lesser amount with respect to the first minority constituent.

An arc brazing method of bonding different materials includes disposing an aluminum alloy to be bonded on a steel base material and arc brazing a welded portion between the steel base material and the aluminum alloy using a wire. The wire is an alloy containing Zn. It is possible to compensate for brittleness due to the bonding of different materials and to improve wettability.

Described herein are compositions for use in the brazing of metal substrates. Methods of making and using these compositions are also described herein.

Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.

Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.

A method of soldering includes providing a substrate having a first metal joining surface, providing a semiconductor die having a second metal joining surface, providing a solder preform having a first interface surface and a second interface surface, arranging the solder preform between the substrate and the semiconductor die such that the first interface surface faces the first metal joining surface and such that the second interface surface faces the second metal joining surface, and performing a mechanical pressure-free diffusion soldering process that forms a soldered joint between the substrate and the semiconductor die by melting the solder preform and forming intermetallic phases in the solder. One or both of the first interface surface and the second interface surface has a varying surface profile that creates voids between the solder preform and one or both of the substrate and the semiconductor die before the melting of the solder preform.

A flux composition includes a component (A) that is a powder of an alkali metal zinc fluoroaluminate represented by “M.sub.wZn.sub.xAl.sub.yF.sub.z (1)” (wherein M is K or Cs, and w, x, y, and z are a positive integer, the greatest common divisor of w, x, y, and z being 1), the content of the component (A) in the flux composition being 50 mass % or more. The flux composition prevents occurrence of a brazing defect and discoloration even when an aluminum alloy is brazed in an atmosphere having a high oxygen concentration, or an atmosphere having high humidity.

A method of manufacturing a terminal-formed electric wire includes a welding member placing process in which at least one welding member formed of metal having a melting point lower than that of a plurality of metal strands included in a core wire is arranged to the core wire of at least a terminal-forming target portion of the electric wire, and a terminal forming process in which the exposed terminal-forming target portion is interposed between first and second electrodes having a shape corresponding to a desired terminal shape, at least the welding member in the terminal-forming target portion is melted by electrically conducting the first and second electrodes while pressing the terminal-forming target portion with the first and second electrodes, and the melted metal is then solidified, so that the terminal-forming target portion is formed as a terminal portion having a desired terminal shape.

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag.sub.2O in terms of oxides and the glass transition point is 180° C. or less.

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.