A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having a melting point of 660° C. or lower on one surface side of the ceramic substrate; a second lamination step of laminating the ceramic substrate and an aluminum sheet through a bonding material on the other surface side of the ceramic substrate; and a heating treatment step of heating the ceramic substrate, the copper sheet, and the aluminum sheet laminated together, and the ceramic substrate and the copper sheet, and the ceramic sheet and the aluminum sheet are bonded at the same time.

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlF.sub.4 and low in K.sub.3AlF.sub.6.

There is provided the use of at least one ionic liquid as a soldering/brazing flux. There is also provided a method of soldering a metal comprising applying a solder/braze comprising a flux to a surface of the metal and heating said metal to a desired soldering/brazing temperature, wherein the soldering/brazing flux comprises one or more ionic liquids.

Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.

Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.

A method of fabricating a joining preform includes the step of printing a self-fluxing joining alloy. Joining includes brazing and soldering. The self-fluxing joining alloy contains at least one of phosphorus, boron, fluorine, chlorine, or potassium. Another printing step prints a non-phosphorous joining alloy. Both printing steps are performed by an additive manufacturing or 3D printing process. The printing a self-fluxing joining alloy step may be repeated until the non-phosphorous joining alloy is substantially encapsulated by the self-fluxing joining alloy. The self-fluxing joining alloy may be a BCuP alloy, a CuP alloy, a CuSnP alloy, a CuSnNiP alloy or a CuAgP alloy. The non-phosphorous joining alloy may be a BAg alloy, a BNi alloy or a BAu alloy.

There is provided the use of at least one ionic liquid as a soldering/brazing flux. There is also provided a method of soldering a metal comprising applying a solder/braze comprising a flux to a surface of the metal and heating said metal to a desired soldering/brazing temperature, wherein the soldering/brazing flux comprises one or more ionic liquids.

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlF.sub.4 and low in K.sub.3AlF.sub.6.

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlF.sub.4 and low in K.sub.3AlF.sub.6.

A method of fabricating a joining preform includes the step of printing a self-fluxing joining alloy. Joining includes brazing and soldering. The self-fluxing joining alloy contains at least one of phosphorus, boron, fluorine, chlorine, or potassium. Another printing step prints a non-phosphorous joining alloy. Both printing steps are performed by an additive manufacturing or 3D printing process. The printing a self-fluxing joining alloy step may be repeated until the non-phosphorous joining alloy is substantially encapsulated by the self-fluxing joining alloy. The self-fluxing joining alloy may be a BCuP alloy, a CuP alloy, a CuSnP alloy, a CuSnNiP alloy or a CuAgP alloy. The non-phosphorous joining alloy may be a BAg alloy, a BNi alloy or a BAu alloy.